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US 6,783,859 B2Granted
Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsShoichi Osada, Shingo Ando, Hiroyuki Takenaka, Kazutoshi Tomiyoshi, Toshio Shiobara
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Abstract
An epoxy resin composition comprising an epoxy resin, a phenolic resin curing agent, an inorganic filler, zinc molybdate on an inorganic support, and a complementary combination of two phosphazene compounds is effectively moldable, flame retardant and suitable for semiconductor encapsulation. A semiconductor device encapsulated with the cured epoxy resin composition is improved in flame retardance and moisture-proof reliability.
Claims3
A semiconductor encapsulating, flame retardant epoxy resin composition comprising as essential components,
- (A) an epoxy resin,
- (B) a curing agent,
- (C) an inorganic filler,
- (D) a molybdenum ingredient having zinc molybdate supported on an inorganic filler,
- (E) a first phosphazene compound having the average compositional formula (1):
- wherein X is a single bond or a group selected from among CH2, C(CH3)2, SO2, S, O, and O(CO)O, subscripts d, e and n are numbers satisfying 0≦d≦0.25n, 0≦e<2n, 2d+e=2n, and 3≦n≦1000, and
- (F) a second phasphazene compound having the average compositional formula (2):
- wherein Y is OH, SH or NH2, R1 is selected from among alkyl and alkoxy groups having 1 to 4 carbon atoms, NH2, NR2R3 and SR2, each of R2 and R3 is hydrogen or an alkyl group having 1 to 4 carbon atoms, and n is a number satisfying 3≦n≦1000,
- said epoxy resin composition being substantially free of bromides and antimony compounds.
6 more elements
Dependencies are inferred from the claim text.