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US 6,783,841 B2Granted
Low signal loss bonding ply for multilayer circuit boards
AssigneeTonoga Inc.
InventorsThomas F. McCarthy, David L. Wynants, Sr.
Life of this patent
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Abstract
A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
Claims30
A low loss circuit board bonding ply having a dissipation factor of less than 0.005 and a dielectric constant of less than 4.0, said low loss circuit board bonding ply comprising
- 0.025 to 0.2 lbs/yd2 of a high flowing thermosetting adhesive composition disposed on a fluoropolymer composite comprising a first fluoropolymer composition comprising a ceramic dielectric modifier and disposed on a substrate selected from nonwoven fabrics, polymeric films and woven fabrics, said woven fabrics being precoated with a filler-free second fluoropolymer composition.
Dependencies are inferred from the claim text.