Resist ink composition
AssigneeShowa Denko K.K.
InventorsTakeo Watanabe, Takashi Sato, Hirotaka Tagoshi
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Abstract
The present invention provides a resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule and a compound (b) capable of initiating cationic polymerization under irradiation by an active energy ray and/or under heat. This resist ink composition has high photosensitivity and enables the final curing by a brief heating and the cured film exhibits good physical properties.
Claims11
A resist ink composition comprising a compound (a) having at least one oxetanyl group and at least one epoxy group within the same molecule represented by formula (1):
- wherein R represents a hydrogen atom or a methyl group, m represents an integer of 0 to 2, and n is 2 when m is 0, and otherwise n is 1, a compound (b) capable of initiating cationic polymerization under irradiation of an active energy ray and/or under heat, a compound (c) having at least one epoxy group and not having an oxetanyl group, a compound (d) having at least one oxetanyl group and not having an epoxy group, a compound (e) having a radical polymerizable unsaturated group as well as a photo-radical polymerization initiator (f).
Dependencies are inferred from the claim text.