Resin composition, adhesive film for semiconductor device, and laminated film with metallic foil and semiconductor device using the same
AssigneeToray Industries, Inc.
InventorsKoichi Fujimaru, Toshio Yoshimura, Nobuo Matsumura
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Abstract
A resin composition has a phase separation structure having at least two phases and inorganic particles having a mean primary particle size of 0.1 μm or less. The phase separation structure includes a matrix phase and a disperse phase. The inorganic particles are mainly present in any one of the matrix phase, the disperse phase, and the interface between the matrix phase and the disperse phase. The resin composition has a high thermal expansion coefficient and elastic modulus, and thus provides an adhesive for semiconductor devices which has excellent reflow resistance and adhesion.
Claims12
A resin composition comprising:
- a thermoplastic resin, a thermosetting resin, a curing agent and inorganic particles, the resin composition comprising a phase separated structure having at least a matrix phase and a disperse phase;
- wherein the inorganic particles have a mean primary particle size of 0.1 μm or less, and furthermore the inorganic particles are substantially present in either the matrix phase or an interface between the matrix phase and the disperse phase, but not present in both the matrix and disperse phases uniformly.
Dependencies are inferred from the claim text.