Methods for making a paste of materials to form bumps for screen print processes
AssigneeSamsung Electronics Co., Ltd.
InventorSang-Don Yi
Life of this patent
Estimating the term…
Abstract
Methods of making a paste of materials used in forming bumps for semiconductor applications wherein the distribution of trace elements is substantially uniform are provided. The methods of making a paste for a semiconductor package process comprises heating and fusing several materials to alloy the materials, rapidly cooling the fused alloy composition to improve conformity of the composition, processing the cooled alloy composition into a fine powder, and processing the alloy powder to be a paste-shape.
Claims24
A method of preparing a paste of two or more component materials to form bumps for a semiconductor package process, the method comprising the steps of:
- (a) heating, fusing and mixing the component materials to form an alloy composition of the materials;
- (b) rapidly cooling the alloy composition to form a cooled alloy composition having a high degree of conformity;
- (c) processing the cooled alloy composition to form a solid;
- (d) processing the solid alloy composition into a fine alloy powder;
- and,
- (e) processing the alloy powder into a paste.
A semiconductor chip comprising one or more bumps consisting essentially of two or more component materials applied thereon, said bumps being formed by the steps of:
- (1) heating, fusing and mixing the component materials to form an alloy composition of the materials;
- (2) rapidly cooling the alloy composition to form a cooled alloy composition having a high degree of conformity;
- (3) processing the cooled alloy composition to form a solid;
- (4) processing the solid alloy composition into a fine alloy powder;
- (5) processing the alloy powder into a paste;
- and,
- (6) applying the paste to a semiconductor chip using a screen print process.
Dependencies are inferred from the claim text.