Systems and methods for the electrolytic removal of metals from substrates
AssigneeMicron Technology, Inc.
InventorsEugene P. Marsh, Stefan Uhlenbrock, Donald L. Westmoreland
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Abstract
The present invention provides methods and systems for the electrolytic removal of platinum and/or other of the Group 8-11 metals from substrates.
Claims40
A method for electrochemically removing a metal from a substrate surface with an electrolyte, the method comprising:
- providing an electrochemical cell comprising:
- a reservoir for containing an electrolyte;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte;
- and
- a counter electrode in electrical contact with the first electrode;
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-11 metal and a combination thereof;
- and
- applying an alternating or bipolar pulsed electrical current to the electrochemical cell.
A method for electrochemically removing a metal from a substrate surface with an electrolyte, the method comprising:
- providing an electrochemical cell comprising:
- a reservoir for containing an electrolyte;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte;
- and
- a counter electrode in electrical contact with the first electrode;
- wherein the substrate is a semiconductor substrate or substrate assembly;
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-11 metal and a combination thereof;
- and
- applying an alternating electrical current to the electrochemical cell.
A method for electrochemically removing a metal from a substrate surface with an electrolyte, the method comprising:
- providing an electrochemical cell comprising:
- a reservoir for containing an electrolyte;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte;
- and
- a counter electrode in electrical contact with the first electrode;
- wherein the substrate is a semiconductor substrate or substrate assembly;
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-11 second row metal, a Group 8-11 third row metal, and a combination thereof;
- and
- applying an alternating or bipolar pulsed electrical current to the electrochemical cell.
A method for electrochemically removing a metal from a substrate surface with an electrolyte, the method comprising:
- providing an electrochemical cell comprising:
- a reservoir for containing an electrolyte;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte;
- and
- a counter electrode in electrical contact with the first electrode;
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-10 second row metal, a Group 8-10 third row metal, and a combination thereof;
- and
- applying an alternating electrical current to the electrochemical cell.
An apparatus for electrochemically removing a metal from a substrate surface with an electrolyte, comprising:
- a reservoir for containing an electrolyte;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte;
- a counter electrode in electrical contact with the first electrode;
- and
- a power supply to deliver alternating or bipolar pulsed electrical current between the first electrode and the counter electrode;
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-11 metal and a combination thereof.
An apparatus for electropolishing of a metal from a substrate surface, comprising:
- an electrolyte composition;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte composition;
- a conductive polishing pad for electrical contact with the first electrode;
- an abrasive for polishing the metal-containing surface;
- a carrier assembly comprising a substrate holder to support the substrate;
- a drive assembly for use in rotating at least one of the substrate holder and conductive polishing pad;
- and
- a power supply to deliver alternating or bipolar pulsed electrical current between the first electrode and the counter electrode,
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-11 metal and a combination thereof.
An apparatus for electrochemically removing a metal from a substrate surface with an electrolyte, comprising:
- a reservoir for containing an electrolyte;
- a first electrode comprising a substrate having a metal-containing surface positioned to interface with the electrolyte;
- a counter electrode in electrical contact with the first electrode;
- and
- a power supply to deliver alternating electrical current between the first electrode and the counter electrode;
- wherein the metal-containing surface comprises a metal selected from the group consisting of a Group 8-11 second row metal, a Group 8-11 third row metal, and a combination thereof.
Dependencies are inferred from the claim text.