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US 6,783,654 B2Granted
Electrolytic plating method and device for a wiring board
AssigneeKabushiki Kaisha Toyoda Jidoshokki Seisakusho
InventorsToshiki Inoue, Kyoko Kumagai
Life of this patent
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Abstract
A plating bath which accommodates an insoluble anode and a printed-circuit board, and a copper dissolved bath which supplies copper ions are arranged. The insoluble anode is arranged as opposed to the printed-circuit board being a cathode, and a forward/reverse current is applied between both of the electrodes. Iron ions are added to a plating solution.
Claims6
An electrolytic plating method, comprising:
- using a wiring board, wherein a surface of the wiring board having formed thereon microvia holes having a copper foil at the bottom of each microvia hole, as one pole, and an insoluble electrode as the other pole;
- stirring a metal plating solution which contains iron ions of at least 0.1 gram/liter so as to make the solution flow in parallel to a surface to be plated of the wiring board;
- and
- performing electrolytic plating by applying a forward/reverse current with the use of a metal plating solution so that the microvia holes having the copper foil at the bottom formed on the surface of the wiring board may be filled up with metal plating.
1 more element
Dependencies are inferred from the claim text.