Process for manufacturing a wiring board

A process for manufacturing a multi-layer wiring board, said process comprising:

• (a) manufacturing a core substrate comprising the steps of:
• making a resin plate having wiring pattern recesses with inner walls therein and having via through holes using a pair of molds;
• coating all of the surfaces of the resin plate including said inner walls of said wiring pattern recesses and said via through holes with a metal film;
• electro-plating using said metal film as a power-supply layer over an entire surface of said metal film to fill a plated metal into said wiring pattern recesses and into said via through holes;
• and
• polishing said plated metal formed on said resin plate to remove the same except for the inner walls of said wiring pattern recesses and of said via through holes to yield a wiring pattern and vias which are exposed on a surface that is the same as that of said resin plate;
• and
• (b) forming resin layers on respective surfaces of said core substrate so that said respective resin layers include wiring pattern recesses having inner walls thereof and include via through holes;
• (c) coating all of the surfaces of said respective resin layers including said inner walls of said wiring pattern recesses and said via through holes with a metal film;
• (d) electro-plating using said metal film as a power-supply layer over an entire surface of said metal film to fill a plated metal into said wiring pattern recesses and into said via through holes;
• and
• (e) polishing said plated metal formed on each of said respective resin layers to remove the same except for the inner walls of said wiring pattern recesses and said via through holes to yield a wiring pattern and vias which are exposed at a surface which is the same as that of the respective resin layer.

A process for manufacturing a wiring board comprising the steps of:

• (a) preparing a laminated body comprising at least one resin layer and at least one wiring pattern on said resin layer;
• (b) forming said resin layer with wiring pattern recesses having inner walls and with via through holes using a mold;
• (c) coating all of the surfaces of the resin layer including said inner walls of said wiring pattern recesses and said via through holes with a metal film;
• (d) electro-plating using said metal film as a power supply layer over an entire surface of said metal film so as to fill a plated metal into said wiring pattern recesses and said via through holes;
• and
• (e) polishing said plated metal formed on said resin layer to remove the same except for the inner walls of said wiring pattern recesses and said via through holes to yield a wiring pattern and vias, so that wiring pattern and said vias are exposed on a surface which is the same as the surface that of said resin layer.

A process for manufacturing a wiring board, said process comprising the steps of:

• molding a resin plate to form wiring pattern recesses and via through holes in said resin plate, said wiring pattern recesses having inner walls;
• coating all of the surfaces of the resin plate including said inner walls of said wiring pattern recesses and said via through holes with a metal film;
• electro-plating using said metal film as a power supply layer over an entire surface of said metal film so as to fill a plated metal into said wiring pattern recesses and said via through holes;
• and
• polishing said plated metal formed on said resin plate to remove the same except for the inner walls of said wiring pattern recesses and said via through holes, to yield a wiring pattern and vias which are exposed on a surface that is the same as that of said resin plate.