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US 6,783,611 B2Granted
Phosphorized copper anode for electroplating
AssigneeMitsubishi Materials Corporation
InventorsKenji Yajima, Akihiro Kakimoto, Hideyuki Ikenoya
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Abstract
A phosphorized copper anode used for electroplating, including: 20-800 ppm of phosphorus; between 0.1 and less than 2 ppm of oxygen, and the balance being high purity copper having a purity of 99.9999% by mass or higher, wherein the average grain size of the copper anode after recrystallization is in the range between about 10 and 50 μm.
Claims1
A phosphorized copper anode used for electroplating, consisting essentially of:
- 20-800 ppm of phosphorus;
- between 0.1 and 1.8 ppm of oxygen, and
- the balance being high purity copper having a purity of 99.9999% by mass or higher,
- wherein the average grain size of said copper anode after recrystallization is in the range between about 10 and 50 μm.
1 more element
Dependencies are inferred from the claim text.