Polishing apparatus
AssigneeEbara Corporation
InventorsTetsuji Togawa, Osamu Nabeya
Life of this patent
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Abstract
A polishing apparatus has a top ring for holding a workpiece to be polished and a polishing table movable relative to the top ring. The polishing table has a polishing surface for polishing the workpiece held by the top ring. The polishing apparatus further has a polishing liquid supply device for supplying a polishing liquid to the polishing surface. At least one of the top ring and the polishing table reciprocates linearly in a first direction. The workpiece can be polished uniformly by the polishing surface because at least one of the top ring and the polishing table reciprocates linearly in the first direction.
Claims14
A polishing apparatus comprising:
- a top ring for holding a workpiece to be polished;
- a polishing table linearly movable relatively to said top ring, said polishing table having a polishing surface for polishing the workpiece held by said top ring, at least one of said top ring and said polishing table reciprocating linearly in a first direction;
- and
- dressers disposed on both sides of said top ring along said first direction for dressing said polishing surface.
A polishing apparatus, comprising:
- a top ring for holding a workpiece to be polished;
- a linear guide;
- a polishing table mounted on said linear guide so as to be capable of being linearly reciprocated along said linear guide in a first direction and so as to be reciprocable with respect to said top ring;
- at least one polishing pad fixed on said polishing table for polishing the workpiece held by said top ring;
- and
- dressers disposed on both sides of said top ring along said first direction for dressing said polishing surface.
Dependencies are inferred from the claim text.