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AssigneeHitachi Chemical Company, Ltd.
InventorsToshihiko Akahori, Toranosuke Ashizawa, Keizo Hirai, Miho Kurihara, Masato Yoshida, Yasushi Kurata
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A CMP abrasive comprising a cerium oxide slurry containing cerium oxide particles, a dispersant and water, and a liquid additive containing a dispersant and water; and a liquid additive for the CMP abrasive. A method for polishing a substrate which comprises holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing platen, followed by pressing, and moving the substrate and the polishing platen while supplying the above CMP abrasive in between the film to be polished and the polishing pad to thereby polish the film to be polished. The CMP abrasive and the method for polishing can be used for polishing a surface to be polished such as a silicone oxide film or a silicon nitride film without contaminating the surface to be polished with an alkali metal such as sodium ions and with no flaws, and the CMP abrasive is excellent in storage stability.
A CMP abrasive comprising
A liquid additive for CMP abrasive comprising a dispersant and water,
A liquid additive for CMP abrasive comprising a dispersant and water, wherein the dispersant is a polymer dispersant, wherein said polymer dispersant is a polymer containing ammonium acrylate as a copolymerized ingredient, a polyammonium-acrylate or a polyamine-acrylate, and wherein the liquid additive contains 1 to 10% by weight of dispersant, and further wherein the dispersant has a weight average molecular weight of 1,000 to 100,000.
A liquid additive for CMP abrasive comprising a dispersant and water, wherein the dispersant is a polymer dispersant, wherein said polymer dispersant is a polyammonium-acrylate or a polyamine-acrylate, and wherein the liquid additive contains 1 to 10% by weight of dispersant, and further wherein the dispersant has a molecular weight distribution (weight average molecular weight/number average molecular weight) of 1.005 to 1.300.
A liquid additive for CMP abrasive comprising a dispersant and water, wherein the dispersant is a polymer dispersant, wherein said polymer dispersant is a polyammonium-acrylate or a polyamine-acrylate, and wherein the liquid additive contains 1 to 10% by weight of dispersant, and further wherein the dispersant contains 10 mol % or less of free ammonia or a free amine, which does not form a salt.
A method for polishing a substrate, comprising holding a substrate having, formed thereon, a film to be polished against a polishing pad of a polishing surface platen, followed by pressing, and moving the substrate and the polishing platen while supplying
Dependencies are inferred from the claim text.