Electrical connector with improved terminals
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorWen He
Life of this patent
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Abstract
An electrical connector (1) for electrically connecting a central processing unit (CPU) with a printed circuit board (PCB). The connector includes a base (2), and a cover (3) slidably engaged on the base. The base includes a body (21), and a multiplicity of holes (211) defined through the body. The holes are arranged in a rectangular array, and retain a multiplicity of terminals (22) therein. Each terminal includes a solder portion (223) adapted to receive a solder ball (224) fused thereon. A curved dimple (2232) is defined in a middle of a bottom of the solder portion. A largest cross-sectional area of the dimple is slightly less than an area of the solder portion.
Claims13
An electrical connector for electrically connecting a central processing unit with a circuit board, the electrical connector comprising:
- a base comprising a body having a multiplicity of electrical terminals received therein;
- and
- a cover engaged on the base;
- wherein each of the terminals comprises a pad-shaped solder portion, a dimple is defined in a bottom surface of the solder portion to receive a block of heat-fusible material therein, and a largest cross-sectional area of the dimple is substantially the same as an area of the solder portion.
An electrical terminal for use with an electrical connector, comprising:
- a contact portion adapted to engage with a mating contact;
- and
- a pad-shaped solder portion defining a dimple in a bottom surface thereof for receiving a block of heat-fusible material therein;
- wherein a largest cross-sectional area of the dimple is substantially the same as an area of the solder portion.
An electrical terminal assembly for use with an electrical connector, comprising;
- a vertical positioning portion;
- a contact portion disposed above said positioning portion;
- and
- a horizontal cantilever type solder portion disposed below said positioning portion;
- wherein
- said solder portion defines a flat top surface and a dimple in an opposite bottom surface, said dimple being dimensioned to be large enough to almost occupy a whole area of said bottom surface.
Dependencies are inferred from the claim text.