Apparatus for connecting semiconductor modules
AssigneeInfineon Technologies AG
InventorsOliver Kiehl, Simon Muff
Life of this patent
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AssigneeInfineon Technologies AG
InventorsOliver Kiehl, Simon Muff
Estimating the term…
The present invention provides an apparatus for connecting semiconductor modules, in particular memory banks, having: at least two devices (A, B) for receiving a respective semiconductor module (1, 2); a contact device (13a, 13b, 13c, 13d, 13e, 13f) having a first group of contacts (13a, 13b, 13c, 13d) and a second group of contacts (13e, 13f), the two groups being able to be connected to one another by means of a variable connection module (3, 4); a group of lines (10, 11, 20, 21) for connecting the receiving devices (A, B) to the first group of contacts (13a, 13b, 13c, 13d), a subgroup (13b, 13c) of the first group of contacts being assigned to the lines (10, 11) of the first receiving device (A); the connection module (3, 4) connecting either a subgroup of the contacts (13b, 13c) to the second group of contacts (13e, 13f), or the first group of contacts (13a, 13b, 13c, 13d) to the second group of contacts (13e, 13f). The present invention likewise provides a method for connecting semiconductor modules, in particular memory banks.
Apparatus for connecting semiconductor modules, the apparatus comprising:
Method for connecting semiconductor modules, the method comprising providing at least two receiving devices for a respective semiconductor module;
An apparatus for connecting first and second semiconductor modules, the apparatus comprising:
A method for connecting first and second semiconductor modules, the method comprising:
Dependencies are inferred from the claim text.