Apparatus and method for testing semiconductor devices
AssigneeASM Assembly Automation Ltd.
InventorsChing Man Tsui, Lap Kei Chow, Hui Fai Ho, Cam Nguyin Ngo
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Abstract
The present invention provides apparatus for supporting during a testing operation a leadframe formed with at least one row of non-singulated semiconductor devices. The apparatus comprises a main body and a leadframe support member, and the leadframe support member is formed with at least one groove for receiving semiconductor devices such that in use leads extending from said devices lie on a surface of said support member. The invention also relates to a system for transporting devices to and from a test probe head.
Claims18
Apparatus for testing non-singulated semiconductor devices formed on a leadframe with unformed leads extending from said devices, comprising:
- a carrier for carrying said leadframe,
- a loading position at which a leadframe is loaded on said carrier,
- means for transporting a loaded carrier to and from a testing means,
- means for supporting said leads during a testing operation,
- means for removing said leadframe from said carrier after testing, and
- means for returning an unloaded carrier to said leadframe loading position.
Dependencies are inferred from the claim text.