Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card

A chip card comprising:

• a chip card body having at least one recess formed therein;
• a conductor track supporting layer for laminating inside the chip card;
• at least one conductor track connected to the conductor track supporting layer by a screen printing paste, or high-viscosity liquid;
• and
• at least one connecting area associated with each of said at least one conductor track
• wherein the conductor track supporting layer has, in the region of the connecting areas, indentations which are filled with the conductive paste, screen printing paste or the high-viscosity liquid,
• wherein the conductor track supporting layer is formed of a plurality of sublayers stacked atop each other and bonded to each other,
• wherein at least two of the sublayers each have at least one through-hole formed therein,
• wherein the through-hole of a first of the plurality of sublayers is in fluid communication with a through-hole formed in a second of the plurality of sublayers,
• wherein the at least one recess is adapted to receive a chip module and/or other electronic component,
• wherein the at least one recess is formed in a side of the conductor track supporting layer which is not coated with the at least one conductor track, and
• wherein the recess has a depth such that a bottom of the recess reaches far enough into the conductor track supporting layer that at least one of the indentations filled with screen printing paste are exposed to the recess.