Actively-cooled distribution plate for reducing reactive gas temperature in a plasma processing system
AssigneeAxcelis Technologies, Inc.
InventorsDavid W. Kinnard, Daniel B. Richardson
Life of this patent
Estimating the term…
Abstract
A plasma processing system is provided, having processor integral cooling passages for reducing an operating temperature thereof during processing of a wafer by the system. Cooling medium inlets and outlets are connected to the cooling passages to permit circulation of a cooling medium through the cooling passages. The baffle plate comprises a generally planar, apertured, gas distribution central portion surrounded by a flange into both of which the cooling passages may extend. Further, the baffle plate may have a non-apertured plate overlying and covering apertures in a central portion of the baffle plate.
Claims14
A plasma processing system comprising:
- (i) a plasma generator;
- (ii) a processing chamber having an interior processing cavity in communication with said plasma generator such that plasma within said generator may pass into said cavity and react with the surface of a substrate residing therein;
- said processing chamber comprising walls which at least partially define said cavity, said walls provided with first cooling passages for reducing an operating temperature thereof, said processing chamber comprising a lower baffle plate and a generally planar upper baffle plate attached to said lower baffle plate and separated by a distance therefrom, said upper baffle plate provided with apertures, and a non-apertured plate overlying and covering apertures in a central portion of the upper baffle plate;
- (iii) a cooling medium inlet and a cooling medium outlet connected to said first cooling passages to permit circulation of a cooling medium through said first cooling passages;
- and
- (iv) a radiant heater assembly for heating the substrate.
A plasma processing system comprising:
- a plasma generator;
- a processing chamber having an interior processing cavity in communication with said plasma generator such that plasma within said generator may pass into said cavity and react with the surface of a substrate residing therein;
- said processing chamber comprising walls which at least partially define said cavity, said walls provided with first cooling passages that contain a cooling medium, said processing chamber comprising
- a baffle plate assembly, that comprises an active cooling system;
- a cooling medium inlet and a cooling medium outlet connected to said first cooling passages to permit circulation of the cooling medium through said first cooling passages;
- a radiant heater assembly for heating the substrate;
- wherein the baffle plate assembly comprises:
- a lower baffle plate comprising first apertures therein;
- and
- an upper baffle plate comprising second apertures therein, wherein the upper baffle plate comprises a non-apertured plate overlying and covering the second apertures in a central portion of the upper baffle plate.
Dependencies are inferred from the claim text.