Method of surface-mounting electronic components

A surface-mounted structure comprising:

• a circuit board with a surface having thereon a plurality of terminal-forming areas each containing terminal parts therein;
• a plurality of electronic components having conductive connecting members thereon;
• and
• an anisotropic conductive layer between and attached to both said surface of said circuit board and said plurality of electronic components, said anisotropic conductive layer being thermally hardened, electrically conductive individually between said terminal parts and corresponding ones of said conductive connecting members of said plurality of electronic components, and being electrically insulative elsewhere.

A method of surface-mounting a plurality of electronic components having conductive connecting members, said method comprising the steps of:

• providing a target surface having a plurality of specified terminal-forming areas thereon, each of said specified terminal-forming areas being no greater than corresponding one of said electronic components and including at least one terminal part therein, at least one of said termninal-forming areas including a plurality of terminal parts directly thereon such that each pair of said terminal parts within any one of said terminal-forming areas is closer to each other than any pair of said terminal parts in different ones of said terminal-forming areas, wherein the terminal parts are distributed in a non-uniform manner depending on the sizes of said terminal-forming areas;
• forming an anisotropic conductive layer on said target surface so as to span said plurality of terminal-forming areas;
• placing said plurality of electronic components on said anisotropic conductive layer individually above said plurality of terminal-forming areas;
• and pressing said plurality of electronic components to said anisotropic conductive layer so as to thereby cause said conductive connecting members of said plurality of electronic components to individually become adhered to and in electrically conductive relationship with a corresponding one of said terminal parts through said anisotropic conductive layer.