Manufacturing process of IC module
OwnerWen-Wen Chiuinventor
Life of this patent
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Abstract
The present invention is to provide a manufacturing process of an integrated circuit module comprising the following steps: (a) providing a circuit board, which has at least one module circuit pattern thereon, said circuit pattern having at least one chip assembly area and an electronic element assembly area; (b) mounting at least one substrate on said at least one chip assembly area; said substrate is provided thereon with at least one connecting circuit pattern which is electrically connected to the at least one module circuit pattern of said circuit board; (c) mounting at least one IC chip on said at least one substrate such that said IC chip is electrically connected to said connecting circuit pattern of the substrate.
Claims11
A manufacturing process of an integrated circuit module comprising the following steps:
- (a) providing a circuit board, which has at least one module circuit pattern thereon, said circuit pattern having at least one chip assembly area and an electronic element assembly area;
- (b) mounting at least one substrate on said at least one chip assembly area;
- said substrate is provided thereon with at least one connecting circuit pattern which is electrically connected to the at least one module circuit pattern of said circuit board;
- (c) mounting at least one IC chip on said at least one substrate such that said IC chip is electrically connected to said connecting circuit pattern of the substrate;
- and
- (d) sheltering said IC chip after the step (c),
- wherein said IC chip is sheltered by means of a cover body covered onto the circuit board and surrounding said substrate, and wherein said cover body is provided with an optical lens.
Dependencies are inferred from the claim text.