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US 6,780,898 B2Granted
Adhesive composition
AssigneeSony Chemicals Corp.
InventorHiroyuki Kumakura
Life of this patent
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Abstract
An adhesive composition is obtained which has high reactivity and is able to connect even plastic substrates with high connection reliability. The adhesive composition is constituted of insulating resin, photopolymerization initiator, and oxetan compound.
Claims4
An adhesive composition, comprising:
- an insulating resin;
- a photopolymerization initiator;
- electrically conductive particles;
- and
- an oxetan compound having two oxetane functional groups, wherein, the oxetan compound is bis(1-ethyl(3-oxetanyl))methyl)ether.
2 more elements
Dependencies are inferred from the claim text.