Method and apparatus for detecting topographical features of microelectronic substrates

An apparatus for detecting characteristics of a microelectronic substrate having a first surface with first topographical features and a second surface facing opposite from the first surface and having second topographical features, the apparatus comprising:

• a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed;
• and
• a topographical feature detector positioned proximate to the support member to align with the first portion of the first surface of the microelectronic substrate, the topographical feature detector including a non-capacitive detection device configured to detect roughness characteristics of the first surface when the microelectronic substrate is carried by the support member, and wherein the topographical feature detector is configured to:
• determine distances from a reference plane to a plurality of the first topographical features;
• select from the determined distances a minimum distance value;
• select from the determined distances a maximum distance value;
• and
• subtract the minimum distance value from the maximum distance value.

An apparatus for detecting characteristics of a microelectronic substrate having a first surface with first topographical features and a second surface facing opposite from the first surface and having second topographical features, the second topographical features including conductive structures protruding from the second surface, the apparatus comprising:

• a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed;
• a first topographical feature detector positioned proximate to the support member to align with the first portion of the first surface of the microelectronic substrate, the first topographical feature detector including a non-capacitive detection device configured to detect roughness characteristics of the first surface when the microelectronic substrate is carried by the support member;
• and
• a second topographical feature detector positioned proximate to the support member and configured to detect a characteristic of the second topographical features when the microelectronic substrate is supported by the support member.

An apparatus for detecting characteristics of a microelectronic substrate having a first surface with first topographical features and a second surface facing opposite from the first surface and having second topographical features, the second topographical features including solder bumps, the apparatus comprising:

• a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed;
• a topographical feature detector positioned proximate to the support member to align with the first portion of the first surface of the microelectronic substrate, the topographical feature detector including a non-capacitive detection device configured to detect roughness characteristics of the first surface when the microelectronic substrate is carried by the support member;
• and
• a raised feature detector positioned proximate to the support member and configured to detect a characteristic of the solder bumps.

An apparatus for detecting characteristics of a microelectronic substrate having a first surface with first topographical features and a second surface facing opposite from the first surface and having second topographical features, the apparatus comprising:

• a support member configured to carry the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed;
• a topographical feature detector positioned proximate to the support member to align with the first portion of the first surface of the microelectronic substrate, the topographical feature detector including a non-capacitive detection device configured to detect roughness characteristics of the first surface when the microelectronic substrate is carried by the support member;
• a first camera positioned proximate to the support member and configured to detect at least one of a position, a surface defect, and a bridge of at least one of the second topographical features of the microelectronic substrate when the microelectronic substrate is supported by the support member;
• and
• a second camera positioned proximate to the support member and configured to detect a height of at least one of the second topographical features of the microelectronic substrate when the microelectronic substrate is supported by the support member.

A detection assembly comprising:

• a microelectronic substrate having a first surface with first topographical features and a second surface facing opposite from the first surface and having second topographical features;
• a support member carrying the microelectronic substrate with a first portion of the first surface exposed and a second portion of the second surface exposed;
• and
• a topographical feature detector positioned proximate to the support member to align with the first portion of the first surface of the microelectronic substrate, the topographical feature detector including a non-capacitive detection device configured to detect roughness characteristics of the first surface when the microelectronic substrate is carried by the support member.