Electronic device
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTakeshi Kobayashi, Hideki Fukazawa, Satoshi Utsunomiya
Life of this patent
Estimating the term…
Abstract
A method for manufacturing an electronic device by placing within a die a first lead with an element placement pad, a second lead, and an electronic element placed on the element placement pad. The electronic element, the element placement pad, a part of the first lead, and a part of the second lead are sealed in a package by injecting a sealing resin in the die from a position on a longer side of the package, with the position being offset toward one shorter side thereof. The first lead is bent in an S shape, with a bending depth being at least as large as the thickness of the first lead. A thickness of the resin on a non-device side of the element placement pad is smaller than the bending depth.
Claims7
A method for manufacturing an electronic device comprising:
- placing within a die a first lead with an element placement pad having a thickness t of less than 0.1 mm, a second lead that is disposed at a distance from said element placement pad, and an electronic element placed on said element placement pad;
- and
- sealing in a package said electronic element, said element placement pad, a part of said first lead, and a part of said second lead by injecting a sealing resin, in a direction substantially parallel to a surface of said element placement pad, in the die from a position on a longer side of the package, said position being offset toward one shorter side thereof;
- wherein a portion of said first lead is bent in a substantially S shape, the S shape portion is substantially confined within the package, a first end of the S shape extends to the element placement pad to mount the electronic element and a portion of a second end of the S shape extends partially outside the package, a bending depth d being at least as large as the thickness t of said first lead, and a thickness T of said resin on a non-device side of said element placement pad is smaller than said bending depth d.
Dependencies are inferred from the claim text.