US 6,779,262 B1Granted

Method for manufacturing a multilayer printed circuit board

AssigneeCircuit Foil Luxembourg Trading Sarl

InventorsRaymond Gales, Damien Michel

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Abstract

A method for manufacturing a multilayer printed circuit board includes providing a core board, a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting resin layer, the functional copper foil being electro-deposited with a uniform thickness of more than 4 μm but less than 10 μm on the carrier foil, the functional copper foil having a front side facing the carrier foil and an opposite backside which is coated with the non-reinforced thermosetting resin layer. The method further involves laminating the composite foil with the non-reinforced thermosetting resin layer on the core board and removing the carrier foil from the functional copper foil in order to uncover the front side of the functional copper foil. A CO2 laser source drills holes from the uncovered front side of the functional copper foil through the functional copper foil and the non-reinforced thermosetting resin layer to form microvias.

Claims22

Dependent claims

A method for manufacturing a multilayer printed circuit board comprising the following steps:

a) providing a core board;
b) providing a composite foil including a carrier foil, a functional copper foil and a non-reinforced thermosetting resin layer, wherein said functional copper foil is electro-deposited with a uniform thickness of more than 4 μm but less than 10 μm on said carrier foil, said functional copper foil having a front side facing said carrier foil and an opposite backside, and said backside being coated with said non-reinforced thermosetting resin layer;
c) laminating said composite foil with said non-reinforced thermosetting resin layer on said core board;
d) removing said carrier foil from said functional copper foil in order to uncover said front side of said functional copper foil;
and
e) using a CO2 laser source to drill holes from said uncovered front side of said functional copper foil through said functional copper foil and said non-reinforced thermosetting resin layer in order to form microvias.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/937,085Filed 17 Jan 2002
Priority: LU 9037623 Mar 1999
Granted: 24 Aug 2004
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 3/025
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates: by transfer of thin metal foil formed on a temporary…
H05K 3/0038
Of organic insulating material: combined with laser drilling through a metal layer
H05K 3/4652
By building the multilayer layer by layer, i.e. build-up multilayer circuits: adding a circuit layer by laminating a metal foil or a preformed…
H05K 3/385
By special treatment of the metal: by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of…