Integrated balun and transformer structures
AssigneeAtheros Communications, Inc.
InventorChik Patrick Yue
Life of this patent
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Abstract
A method for producing an on-chip signal transforming device. The method includes providing a substrate, and laying a first conductive layer above the substrate, wherein the first conductive layer has a plurality of interleaved inductors. The method then includes laying a second conductive layer above the substrate, wherein the second conductive layer has at least one inductor.
Claims11
A method for producing an on-chip signal transforming device, the method comprising:
- providing a substrate;
- laying a first conductive layer above the substrate, wherein the first conductive layer has formed thereon a first plurality of inductors disposed in interleaved manner;
- and
- laying a second conductive layer above the substrate and insulated from the first conductive layer, wherein the second conductive layer has formed thereon at least one inductor DC isolated from the first plurality of interleaved inductors.
A method for producing an on-chip signal transforming device, the method comprising:
- providing a substrate;
- laying a first conductive layer above the substrate, wherein the first conductive layer has formed thereon a first plurality of inductors disposed in interleaved manner;
- and
- laying a second conductive layer above the substrate insulated from the first conductive layer, wherein the second conductive layer has formed thereon a second plurality of interleaved inductors DC isolated from the first plurality of interleaved inductors.
A method for producing an on-chip signal transforming device, the method comprising:
- providing a substrate;
- laying a first conductive layer above the substrate, wherein the first conductive layer has formed thereon a first plurality of inductors disposed in interleaved manner;
- and
- laying a second conductive layer above the substrate insulated from the first conductive layer, wherein the second conductive layer has formed thereon a first part of an inductor DC isolated from the first plurality of interleaved inductors;
- laying a third conductive layer insulated from the first and second conductive layers;
- and
- wherein the inductor has a second part in the third conductive layer, the first part and the second part are connected by way of a via and the first conductive layer is disposed between the second conductive layer and the third conductive layer.
A method for producing an on-chip signal transforming device, the method comprising:
- providing a substrate;
- laying a first conductive layer above the substrate, wherein the first conductive layer has formed thereon a first spiral inductor and a second spiral inductor;
- and
- laying a second conductive layer above the substrate insulated from the first conductive layer, wherein the second conductive layer has formed thereon at least a portion of the second spiral inductor, such that the first and second spiral inductors are interleaved, the portion of the second spiral inductor formed on the second conductive layer crossing the first spiral inductor.
A method for producing an on-chip signal transforming device, the method comprising:
- providing a substrate;
- laying a first conductive layer above the substrate, wherein the first conductive layer has a first spiral inductor and a second spiral inductor that are disposed in interleaved manner;
- and
- laying a second conductive layer above the substrate insulated from the first conductive layer;
- providing a conductive path from the first conductive layer to the second conductive layer and back to the first conductive layer to allow the first spiral inductor to cross over the second spiral inductor.
Dependencies are inferred from the claim text.