Overmolded electronic package including circuit-carrying substrate

A method of forming an overmolded electronic package including a circuit-carrying substrate, the method comprising the steps of:

• providing a connector shroud having a number of electrically conductive leads extending therethrough;
• attaching said connector shroud to one of a backplate and the circuit-carrying substrate;
• attaching the circuit-carrying substrate to said backplate;
• connecting said number of electrically conductive leads to corresponding conductive pads defined on said substrate;
• and
• overmolding at least said connector shroud and said circuit-carrying substrate with a rigidly formable molding compound to form said overmolded electronic package.

A method of forming an overmolded electronic package including a circuit-carrying substrate, the method comprising the steps of:

• attaching the circuit-carrying substrate to a backplate;
• providing a connector shroud having a number of electrically conductive leads extending therethrough;
• connecting said number of electrically conductive leads to corresponding conductive pads defined on said substrate;
• and
• overmolding at least said connector shroud and said circuit-carrying substrate with a rigidly formable molding compound to form said overmolded electronic package.

A method of forming an overmolded electronic package including a circuit-carrying substrate, the method comprising the steps of:

• providing a connector shroud having a number of electrically conductive leads extending therethrough;
• connecting said number of electrically conductive leads to corresponding conductive pads defined on the circuit-carrying substrate;
• overmolding said connector shroud and circuit-carrying substrate with a rigidly formable molding compound while leaving at least partially exposed an underside of said connector shroud and an underside of said circuit-carrying substrate;
• and
• attaching a backplate to said undersides of said connector shroud and said substrate after the overmolding step to form said overmolded electronic package.

A method of forming an overmolded electronic package including a circuit-carrying substrate having a number of flip-chip circuits mounted thereto, the method comprising the steps of:

• providing a backplate having a number of thermally conductive posts extending therefrom;
• attaching the circuit-carrying substrate to said backplate with each of said number of flip-chip circuits mounted to a corresponding one of said number of thermally conductive posts;
• providing a connector shroud having a number of electrically conductive leads extending therethrough;
• connecting said number of electrically conductive leads to corresponding conductive pads defined on said substrate;
• and
• overmolding said connector shroud, said circuit-carrying substrate and said backplate with a rigidly formable molding compound to form said overmolded electronic package.