Integrated circuit inductors
AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
Life of this patent
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Abstract
The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.
Claims36
A method comprising:
- boring a plurality of holes in a substrate;
- and
- fabricating a conductive path linking the plurality of holes, wherein boring includes irradiating the substrate.
A method comprising:
- boring a plurality of holes in a substrate;
- and
- fabricating a conductive path linking the plurality of holes wherein boring a plurality of holes in the substrate comprises:
- positioning a drill on the substrate;
- and
- drilling a hole in the substrate.
A method comprising:
- boring a plurality of holes in a substrate;
- and
- fabricating a conductive path linking the plurality of holes wherein boring a plurality of holes in the substrate comprises:
- aiming a laser at the substrate;
- and
- burning a hole in the substrate.
A method comprising;
- boring a number of substantially parallel holes in a substrate having a coating;
- depositing a conductive path linking the number of holes and operable for inducing a magnetic flux in the coating, wherein boring includes irradiating the substrate.
A method comprising:
- drilling a plurality of holes in a substrate;
- filling the plurality of holes with a conductive material to form a plurality of conductive segments;
- and
- interconnecting the plurality of conductive segments to form a coil.
A method of forming an inductor, comprising:
- coating a portion of a surface of a substrate with a magnetic film;
- boring a plurality of through holes adjacent the magnetic film that pass through the substrate;
- and
- forming a conductive path integral with the substrate by forming first conductive segments in the through holes and forming second conductive segments that connect to the first conductive segments to form a coil.
A method of forming an inductor integral with a semiconductor substrate, comprising:
- forming a plurality of holes in the semiconductor substrate that connect opposing surfaces of the substrate;
- and
- interweaving a conductor through the plurality of holes to form a coil surrounding a portion of the substrate, wherein forming the plurality of holes includes irradiating the semiconductor substrate.
A method of forming an inductor integral with a semiconductor substrate, comprising:
- forming a plurality of holes in the semiconductor substrate that connect opposing surfaces of the substrate;
- and
- interweaving a conductor through the plurality of holes to form a coil surrounding a portion of the substrate, wherein the coil has an inductance, and further comprising:
- forming a magnetic film on one of the surfaces of the substrate;
- and traversing the magnetic film with a portion of the coil so as to increase the inductance of the coil.
A method of forming an inductor integral with a semiconductor substrate, comprising:
- forming a plurality of holes in the semiconductor substrate that connect opposing surfaces of the substrate;
- and
- interweaving a conductor through the plurality of holes to form a coil surrounding a portion of the substrate, wherein forming the plurality of holes includes drilling the holes with a laser.
A method of forming an inductor integral with a semiconductor substrate, comprising:
- forming a plurality of holes in the semiconductor substrate that connect opposing surfaces of the substrate;
- and
- interweaving a conductor through the plurality of holes to form a coil surrounding a portion of the substrate, wherein forming the plurality of holes includes drilling the holes with a drill bit.
A method of forming an inductor comprising;
- forming a coating on a portion of a surface of a substrate;
- forming a plurality of holes through the substrate adjacent opposing edges of the coating;
- and
- forming a conductive coil that passes through the plurality of holes and is operable to induce a magnetic flux in the coating, wherein forming the plurality of holes includes irradiating the substrate.
A method of forming an inductor comprising:
- forming a coating on a portion of a surface of a substrate;
- forming a plurality of holes through the substrate adjacent opposing edges of the coating;
- and
- forming a conductive coil that passes through the plurality of holes and is operable to induce a magnetic flux in the coating, wherein forming the coating includes depositing a magnetic film.
A method of forming an inductor, comprising;
- boring a plurality of holes in a semiconductor substrate;
- and
- forming a conductive coil integral with the substrate, the conductive coil having segments passing through the plurality of holes, wherein boring includes irradiating the substrate.
A method of forming an inductor, comprising;
- boring a plurality of holes in a semiconductor substrate;
- and
- forming a conductive coil integral with the substrate, the conductive coil having segments passing through the plurality of holes, including boring the plurality of holes so as to form a conductive coil having a triangular cross-section.
A method of forming an inductor, comprising;
- boring a plurality of holes in a semiconductor substrate;
- and
- forming a conductive coil integral with the substrate, the conductive coil having segments passing through the plurality of holes, wherein boring the plurality of holes includes irradiating the substrate with a laser.
A method of forming an inductor, comprising;
- boring a plurality of holes in a semiconductor substrate;
- and
- forming a conductive coil integral with the substrate, the conductive coil having segments passing through the plurality of holes, wherein boring the plurality of holes includes drilling the substrate with a drill bit.
Dependencies are inferred from the claim text.