Method of producing suspended elements for electrical connection between two portions of a micromechanism which can move relative to one another

A method of producing suspended elements between two portions of a micro-mechanism containing components that move relative to one another on a semiconductor wafer, the method comprising:

• applying the adhesive side of a dry film over the micro-mechanism on the semiconductor wafer to immobilize the moveable components without penetrating any cavities therein;
• forming a mask on the dry film;
• depositing, developing, and selectively removing a sacrificial layer from the mask and the dry film to form windows on the dry film, the dry film protecting the cavities from infiltration of liquids during the developing step;
• opening the windows by selectively etching the dry film;
• depositing a dielectric layer to cover the windows without penetrating any underlying cavities;
• depositing a conductive layer that is attached to at least one moveable portion of the micro-mechanism;
• and
• selectively removing the conductive layer and the dielectric layer, and removing the dry film to form electrical connection elements suspended between the two portions of the micro-mechanism containing components that move relative to one another.