Telecommunication relay array for DSL network configuraton
AssigneeAlcatel
InventorBruce Francis Orr
Life of this patent
Estimating the term…
Abstract
This invention provides an electromagnetic relay formed on a substrate (1), preferably a multi-layer printed circuit board. The magnetic circuit (4, 5, 6a, 6b, 7a, 7b) passes through holes (2, 3) in the substrate, and is formed using printed circuit manufacturing techniques, such as electroplating to manufacture the plated through holes. The armature 7b is formed by depositing the armature material on a temporary layer, which is then removed.
Claims15
A micro relay device comprising:
- a single support member;
- a magnetic path formed of a movable, flexible armature at least partly of magnetizable material, the magnetic path including magnetizable material carried by said support member, the support member including first and second plated through holes to permit the magnetic path to pass from a first side of the support member to a second side, the armature being proximate to the first side and being attached at one end thereof to said first plated through hole;
- and
- a fixed contact attached to said second plated through hole, the magnetic path extending between said through holes on the second side.
A micro relay device including a support member, first and second through holes containing magnetic material and traversing first and second sides of said support member, at least one fixed contact on said first side, a moving armature formed at least partly of magnetic material located proximal to said first side, a magnetic return path located proximal to said second side and at least one electrical activation path located within or on the surface of said support member.
Dependencies are inferred from the claim text.