Cleaning system, device and method

A cleaning device for cleaning the probe elements in a semiconductor testing apparatus, the cleaning device comprising:

• a substrate having a configuration to be introduced into the testing apparatus during the normal testing operation of the testing apparatus;
• and
• a cleaning pad having one or more layers of chemicals that clean the probe elements and one or more sealing layers that confine the chemical layers and keeps debris removed from the probe elements in the cleaning pad so that the probe elements are cleaned during the normal operations of the testing machine, wherein the one or more layers comprise a first layer of gelled acid and a second layer of gelled oxidizing agent.

A method for cleaning the probe elements of a testing machine, the method comprising:

• loading a cleaning device into the prober, the cleaning device having the same configuration as the wafers with the semiconductor dies normally tested by the testing apparatus, the cleaning device having a top surface with predetermined properties that clean the probe elements;
• and
• contacting the probe elements with the cleaning device during the normal testing operation of the prober so that any debris is removed from the probe elements during the normal operation of the testing machine, the cleaning device having one or more layers of chemicals that clean the probe elements and one or more sealing layers that confine the chemical layers and keeps debris removed from the probe elements in the cleaning pad so that the probe elements are cleaned during the normal operations of the testing machine, wherein the one or more layers comprise a first layer of gelled acid and a second layer of gelled oxidizing agent.

A cleaning device for cleaning probe elements comprising:

• a substrate having a predetermined configuration appropriate for the particular probe elements, wherein the substrate comprises a semiconductor wafer;
• and
• a pad, secured to the substrate, the pad having predetermined characteristics that cause the pad to clean debris from the probe elements when the probe elements contact the pad so that the probe elements are cleaned, wherein the pad comprises one or more layers of chemical cleaning agents, which may oxidize and/or reduce contaminates when the probe elements are inserted into the pad and wherein one or more layers comprise a first layer of gelled acid and a second layer of gelled oxidizing agent.

A cleaning device for cleaning the probe elements in a semiconductor testing apparatus, the cleaning device comprising:

• a substrate having a configuration to be introduced into the testing apparatus during the normal testing operating of the testing apparatus, wherein the substrate comprises a semiconductor wafer having a surface;
• and
• a pad, secured to the substrate, the pad having predetermined characteristics that cause the pad to clean debris from the probe elements when the probe elements contact the pad so that the probe elements are cleaned, without modification or damage, during the normal operation of the testing machine, wherein the semiconductor wafer surface has microroughness which burnishes the probe elements.

A cleaning device for cleaning the probe elements in a semiconductor testing apparatus, the cleaning device comprising:

• a substrate having a configuration to be introduced into the testing apparatus during the normal testing operation of the testing apparatus, the substrate comprising a semiconductor wafer having a surface;
• and
• a cleaning pad having one or more layers of chemicals that clean the probe elements and one or more sealing layers that confine the chemical layers and keeps debris removed from the probe elements in the cleaning pad so that the probe elements are cleaned during the normal operations of the testing machine, wherein the semiconductor wafer surface has microroughness which burnishes the probe elements.

A cleaning device for cleaning probe elements comprising:

• a substrate having a predetermined configuration appropriate for the particular probe elements, wherein the substrate comprises a semiconductor wafer having a surface;
• and
• a pad, secured to the substrate, the pad having predetermined characteristics that cause the pad to clean debris from the probe elements when the probe elements contact the pad so that the probe elements are cleaned, wherein the semiconductor wafer surface has microroughness which burnishes the probe elements.