Film formation apparatus and film formation method and cleaning method

A film formation apparatus for forming a film over a substrate by depositing an organic compound material from a deposition source provided opposite to the substrate, said film formation apparatus comprising;

• a film formation chamber to provide said substrate therein,
• an adhesion prevention means provided in said film formation chamber for preventing film formation in the inner wall;
• a heating means provided in said film formation chamber for heating the adhesion prevention means;
• the deposition source provided in said film formation chamber,
• a means provided in said film formation chamber for heating the deposition source;
• and
• a heating means provided in said film formation chamber for heating a mask;
• and
• a vacuum gas discharge treatment chamber for vacuum evacuating the film formation chamber,
• wherein the film formation chamber is connected with said vacuum gas discharge treatment chamber.

A film formation apparatus comprising:

• a load chamber,
• a transportation chamber, and
• a film formation chamber joined to each other in series,
• wherein said film formation chamber has a function of conforming the positioning of a mask and a substrate and said film formation chamber is connected with a vacuum gas discharge treatment chamber for vacuum evacuating the film formation chamber and comprises an adhesion prevention means for preventing film formation in the inner wall, a heating means for heating the adhesion prevention means, the deposition source, a means for heating the deposition source, and a heating means for heating a mask.

A film formation apparatus comprising:

• a load chamber;
• a transportation chamber connected with said load chamber;
• and
• a film formation chamber connected with said transportation chamber,
• wherein said transportation chamber has a function of conforming the positioning of a mask and a substrate and said film formation chamber is connected with a vacuum gas discharge treatment chamber for vacuum evacuating the film formation chamber and said film formation chamber comprises an adhesion prevention means for preventing film formation in the inner wall, a heating means for heating the adhesion prevention means, the deposition source, a means for heating the deposition source, and a heating means for heating a mask.

A film formation apparatus for forming a film over a substrate by depositing an organic compound material from a deposition source provided opposite to the substrate, said film formation apparatus comprising:

• a film formation chamber to provide said substrate therein,
• a deposition source provided in said film formation chamber;
• a means provided in said film formation chamber for heating the deposition source;
• a heating means provided in said film formation chamber for heating a substrate;
• a mask provided in said film formation chamber, and
• an electrode provided in said film formation chamber and opposite to the mask;
• and
• a vacuum gas discharge treatment chamber for vacuum evacuating the film formation chamber,
• wherein the film formation chamber is connected with the vacuum gas discharge treatment chamber and plasma is generated in the film formation chamber.

A film formation apparatus for forming a film over a substrate by depositing an organic compound material from a deposition source provided opposite to the substrate, said film formation apparatus comprising:

• a film formation chamber to provide said substrate therein;
• a deposition source provided in said film formation chamber;
• a means provided in said film formation chamber for heating the deposition source;
• a heating means provided in said film formation chamber for heating a substrate;
• and
• a vacuum gas discharge treatment chamber for vacuum evacuating the film formation chamber,
• wherein the film formation chamber is connected with the vacuum gas discharge treatment chamber and also with a cleaning preparatory chamber for radiating laser beam to the inner wall of said treatment chamber.