Semiconductor integrated circuit and nonvolatile memory element
AssigneeRenesas Technology Corp.
InventorsShoji Shukuri, Kazuhiro Komori, Katsuhiko Kubota, Kousuke Okuyama
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AssigneeRenesas Technology Corp.
InventorsShoji Shukuri, Kazuhiro Komori, Katsuhiko Kubota, Kousuke Okuyama
Estimating the term…
Owing to the above, even with the single-layer gate process such as single-layer polysilicon gate process, it is possible to obtain a semiconductor integrated circuit such as system LSI in which a nonvolatile memory which is excellent in data retention capability is merged and packaged with a DRAM etc. Further, since the nonvolatile memory of high reliability can be formed without adding any step to a related art manufacturing process, such as a standard CMOS manufacturing process, the present invention may be readily applied to an LSI in which the nonvolatile memory and a logic LSI, or the nonvolatile memory and a DRAM are merged and packaged on an identical semiconductor substrate. Accordingly, a system LSI in which a flash memory is merged and packaged can be provided without increasing the cost of manufacture.
A semiconductor integrated circuit device on a semiconductor substrate, comprising:
A semiconductor integrated circuit device formed on a semiconductor substrate by a single layer polycrystalline silicon process, comprising:
Dependencies are inferred from the claim text.