Metal frame for electronic hardware and flat panel displays

A metal electronics frame comprising:

• a body having walls defining at least one enclosure;
• wherein the enclosure is designed to at least partially encase at least one electronic component;
• wherein at least a portion of the body is formed from a bulk-solidifying amorphous alloy material having an elastic limit of about 1.5% or greater and a ΔTsc of more than 30° C.;
• and
• wherein the bulk-solidifying amorphous alloy also has at least two of the physical properties selected from the group consisting of:
• a yield strength of about 2.0 GPa or greater, a hardness of about 4.5 GPa or greater, a high fracture toughness of at least about 10 ksi-in, and a density of from about 6.5 g/cc or less.

A metal electronics frame comprising:

• a body having walls defining at least one enclosure;
• wherein the enclosure is designed to at least partially encase at least one electronic component;
• wherein at least a portion of the body is formed from a bulk-solidifying amorphous alloy material having an elastic limit of about 1.5% or greater and a ΔTsc of more than 30° C.;
• and
• wherein the bulk-solidifying amorphous alloy also has at least two of the physical properties selected from the group consisting of:
• a yield strength of about 2.0 GPa or greater, a hardness of about 5.5 GPa or greater, a high fracture toughness of at least about 20 ksi-in, and a density of from about 6.5 g/cc or less.

A method of manufacturing a metal electronics frame comprising:

• providing a blank from a bulk-solidifying amorphous alloy having an elastic limit of at least 1.5% and a ΔTsc of more than 30° C.;
• heating the blank around the glass transition temperature of the bulk-solidifying amorphous alloy;
• and
• molding the blank to form at least a portion of a metal electronics frame to encase at least one electronic component.

A method of manufacturing a metal electronics frame comprising:

• providing a blank from a bulk-solidifying amorphous alloy;
• heating the blank around the glass transition temperature of the bulk-solidifying amorphous alloy;
• and
• molding the blank to form at least a portion of a metal electronics frame to encase at least one electronic component,
• wherein the bulk-solidifying amorphous alloy has an elastic limit of about 1.5% or greater, a ΔTsc of more than 30° C., and at least two of the physical properties selected from the group consisting of:
• a yield strength of about 2.0 GPa or greater, a hardness of about 4.0 GPA or greater, a high fracture toughness of at least about 10 ksi-in, and a density of from about 6.5 g/cc or less.

A method of manufacturing a metal electronics frame comprising:

• providing a blank from a bulk-solidifying amorphous alloy;
• heating the blank around the glass transition temperature of the bulk-solidifying amorphous alloy;
• and
• molding the blank to form at least a portion of a metal electronics frame to encase at least one electronic component,
• wherein the bulk-solidifying amorphous alloy has an elastic limit of about 2.0% or greater, a ΔTsc of more than 60° C., and at least two of the physical properties selected from the group consisting of:
• a yield strength of about 2.0 GPa or greater, a hardness of about 5.5 GPA or greater, a high fracture toughness of at least about 20 ksi-in, and a density of from about 6.5 g/cc or less.

A method of manufacturing a metal electronics frame comprising:

• providing a feedstock in the form of a molten alloy above the melting temperature;
• and
• casting the feedstock to form a portion of a metal electronics frame of a bulk-solidifying amorphous alloy, wherein the metal electronics frame is designed to encase at least one electronic component,
• wherein the bulk-solidifying amorphous alloy has an elastic limit of about 1.5% or greater, a ΔTsc of more than 30° C., and at least two of the physical properties selected from the group consisting of:
• a yield strength of about 2.0 GPa or greater, a hardness of about 4.0 GPA or greater, a high fracture toughness of at least about 10 ksi-in, and a density of from about 6.5 g/cc or less.

A method of manufacturing a metal electronics frame comprising:

• providing a feedstock in the form of a molten alloy above the melting temperature;
• and
• casting the feedstock to form a portion of a metal electronics frame of a bulk-solidifying amorphous alloy, wherein the metal electronics frame is designed to encase at least one electronic component,
• wherein the bulk-solidifying amorphous alloy has an elastic limit of about 2.0% or greater, a ΔTsc of more than 60° C., and at least two of the physical properties selected from the group consisting of:
• a yield strength of about 2.0 GPa or greater, a hardness of about 5.5 GPA or greater, a high fracture toughness of at least about 20 ksi-in, and a density of from about 6.5 g/cc or less.