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US 6,770,822 B2Granted
High frequency device packages and methods
AssigneeBridgewave Communications, Inc.
InventorsEliezer Pasternak, Sean Cahill, Bance Hom
Life of this patent
Estimating the term…
Abstract
A high frequency device packing method and package are described wherein coaxial structures are formed from the high frequency device to the via. A coaxial via structure and a micro-coaxial bonding wire are described.
Claims31
An electrical component package comprising:
- an electrically conductive base having a coaxial via, the coaxial via including a center pin surrounded by an insulating ring such that the insulating ring electrically isolates the center pin from the rest of the base;
- an electrical component mounted on a first surface of the base;
- and
- a coaxial wire connecting the electrical component to the base, wherein the coaxial wire includes a wire capable of electrically coupling the electrical component to the center pin, an insulation layer surrounding the wire, and an electrically conductive shield coating the insulation layer.
1 more element
A structure for packaging electrical components, the structure comprising:
- an electrically conductive base material having at least one coaxial via, the coaxial via including a center pin surrounded by an insulating ring such that the insulating ring electrically isolates the center pin from the rest of the base material;
- and
- a micro-coaxial wire extending fern the coaxial via, wherein the coaxial wire includes a wire, an insulation layer surrounding the wire, and an electrically conductive shield coating the insulation layer, and wherein the wire is electrically coupled to the center pin and the conductive shield is electrically coupled to the base to form a coaxial connection.
An electrical device comprising:
- an electrically conductive base having a coaxial via, the coaxial via including a center pin surrounded by an insulating ring such that the insulating ring electrically isolates the center pin from the rest of the base;
- an electrical component mounted on a first surface of the base;
- and
- a coaxial wire connecting the electrical component to the base, wherein the coaxial wire includes a wire for electrically coupling the electrical component to the center pin, an insulation layer surrounding the wire, and an electrically conductive shield coating the insulation layer, wherein the coaxial wire and the coaxial via maintain a substantially constant characteristic impedance connection from the electrical component to an outside connection point through the base.
1 more element
Dependencies are inferred from the claim text.