Mold and method for encapsulation of electronic device
AssigneeAsm Technology Singapore Pte Ltd
InventorsTeng Hock Kuah, Shu Chuen Ho, Charles Joseph Vath, III, Loon Aik Lim, Man Ho Hui, Juay Sim Koh
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Abstract
A mold (1) is for molding a one-sided encapsulated electronic device. The mold (1) includes a first mold section (2) defining a mold cavity (4), and a second mold section (3) including a first recessed portion (6) adapted to receive a layer of material (15) attached to a leadframe (10), but not the leadframe (10).
Claims18
A mold for molding a one-sided encapsulated electronic device from a leadframe, a layer of material being attached to one side of the leadframe, the mold comprising:
- a first mold section defining a mold cavity;
- and
- a second mold section, the first and second mold sections configured to receive the leadframe therebetween for molding the one-sided encapsulated electronic device, the second mold section including a first recess sized to receive the entire layer of material attached to the leadframe and sized smaller than the leadframe so that the leadframe extends over the first recess without being received within the first recess.
A method of forming a one-sided encapsulated electronic device, comprising:
- forming a leadframe assembly by:
- (i) attaching a layer of material to one side of a leadframe, the leadframe including contact portions,
- (ii) attaching a die to a die attach portion of the leadframe on another side of the leadframe, the die including contact portions, and
- (iii) bonding wires between the contact portions of the die and the contact portions of the leadframe;
- inserting the leadframe assembly into a mold, the mold including a first mold section defining a mold cavity, and a second mold section including a first recess sized to receive the entire layer of material attached to the leadframe and sized smaller than the leadframe so that the leadframe extends over the first recess without being received within the first recess;
- and
- inserting a molding material into the mold cavity of the first mold section to form the one-sided encapsulated electronic device.
Dependencies are inferred from the claim text.