Method and apparatus for resolving conflicts in a substrate processing system
AssigneeASML Holding N.V.
InventorHilario Oh
Life of this patent
Estimating the term…
Loading patent…
AssigneeASML Holding N.V.
InventorHilario Oh
Estimating the term…
A wafer track and lithography cluster tool for performing a series of processes with a scheduler which synchronizes all events in a substrate processing system. Events in the cluster tool are scheduled to occur at regular, periodic intervals, thereby improving throughput and quality. The scheduler also eliminates conflicts for transportation resources between modules in the cluster tool. Wafers are loaded into the cluster tool at a regular interval, referred to as a sending period. All events in the system are synchronized with the sending period, and all event timings are normalized in terms of the sending period. The conflicts are resolved by selectively adding delays in modules which can tolerate them without degrading throughput or performance in the system; modules that cannot tolerate delays are exempted. The periodicity of the scheduled cluster tool enables the identification of wafers in the cluster tool. The identification of the order in which a wafer was loaded also identifies a module path followed by the wafer.
A method of optimizing throughput and performance in a wafer processing system comprising the following steps:
An apparatus for scheduling allocation of a plurality of transportation resources between modules within a wafer track/stepper cluster for a sequential wafer manufacturing process comprising:
A method for synchronizing a wafer processing system comprising the following steps:
Dependencies are inferred from the claim text.