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US 6,765,801 B1Granted
Optical track drain package
AssigneeAmkor Technology, Inc.
InventorsThomas P. Glenn, Roy Dale Hollaway
Life of this patent
Estimating the term…
Abstract
A package includes a substrate having a pocket, an overflow reservoir around a periphery of the pocket, and a mating surface around a periphery of the overflow reservoir. An electronic component is mounted within the pocket. The pocket is over filled with a flowable material. A window or waveguide is mounted to the substrate. The overflow reservoir captures the flowable material that spills out of the pocket during mounting of the window or waveguide thus preventing contamination of the mating surface.
Claims20
A package comprising:
- a substrate comprising:
- a pocket;
- an overflow reservoir around a periphery of said pocket;
- and
- a mating surface around a periphery of said overflow reservoir;
- a first electronic component coupled within said pocket;
- a sealing encapsulant filling said pocket, said sealing encapsulant comprising an exterior surface coplanar with said mating surface;
- and
- excess encapsulant within said overflow reservoir, wherein said excess encapsulant comprises an exterior surface below said mating surface.
6 more elements
A package comprising:
- a substrate comprising:
- a pocket;
- a pocket base surface;
- a pocket sidewall surface, said pocket base surface and said pocket sidewall surface defining said pocket;
- an overflow reservoir around a periphery of said pocket;
- a drain base surface;
- a drain inner sidewall surface;
- a drain outer sidewall surface, said drain base surface, said drain inner sidewall surface, and said drain outer sidewall surface defining said overflow reservoir;
- a mating surface around a periphery of said overflow reservoir and extending from said drain outer sidewall surface;
- and
- a runner surface extending between said drain inner sidewall surface and said pocket sidewall surface, wherein said runner surface is below said mating surface;
- a first electronic component coupled within said pocket;
- a sealing encapsulant filling said pocket, said sealing encapsulant comprising an exterior surface coplanar with said mating surface;
- and
- excess encapsulant within said overflow reservoir.
12 more elements
A package comprising:
- a substrate comprising:
- a pocket;
- an overflow reservoir around a periphery of said pocket;
- a runner surface extending between said pocket and said overflow reservoir;
- and
- a mating surface around a periphery of said overflow reservoir;
- a first electronic component coupled within said pocket;
- a sealing encapsulant filling said pocket, said sealing encapsulant extending over and above said runner surface;
- and
- excess encapsulant within said overflow reservoir.
7 more elements
Dependencies are inferred from the claim text.