# US 6,763,156 B2 · Flexible optoelectronic circuit and associated method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,763,156 B2 - Document ID: US6763156B2 - Status: Granted - Kind: B2 - Application number: 10/170,714 - Filed: 2002-06-12 - Published: 2003-12-18 - Granted: 2004-07-13 - Earliest claimed: 2002-06-12 - Assignees: Mcnc - Inventors: William Devereux Palmer; Richard LaBennett - Web page: https://patentgrep.com/patent/US6763156B2 ## CPC - G02B 6/1221: {made from organic materials} - G02B 6/132: by deposition of thin films - G02B 6/138: by using polymerisation - G02B 2006/12147: {Coupler} - G02B 2006/1215: {Splitter} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract A flexible optoelectronic circuit is assembled on and released from a substrate, and therefore independent of a substrate. The substrate includes semiconductor substrates having a release layer. The release layer is etched to release the optoelectronic circuit such that the resulting circuit is flexible. Both optical elements, such as waveguides, and conductive elements are formed in layers, generally between insulating layers. The elements may be formed and patterned using standard semiconductor manufacturing techniques. ## Claims ### Claim 1 A flexible optoelectronic circuit, comprising: a first flexible insulating layer; at least one optical element deposited on a portion of the first insulating layer; and a second flexible insulating layer deposited on the first insulating layer and the at least one optical element, wherein the optoelectronic circuit is independent of a substrate. ### Claim 2 (depends on 1) The flexible optoelectronic circuit according to claim 1, wherein the at least one optical element comprises a first material and the first and second insulating layers comprise a second material, the first material having a higher refractive index than the second material. ### Claim 3 (depends on 2) The flexible optoelectronic circuit according to claim 2, wherein the first material comprises a transparent organic material. ### Claim 4 (depends on 3) The flexible optoelectronic circuit according to claim 3, wherein the transparent organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 5 (depends on 2) The flexible optoelectronic circuit according to claim 2, wherein the second material comprises a photoimagable organic material. ### Claim 6 (depends on 5) The flexible optoelectronic circuit according to claim 5, wherein the photoimagable organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 7 (depends on 2) The flexible optoelectronic circuit according to claim 2, wherein the at least one optical element is integrally formed between first and second insulating layers. ### Claim 8 (depends on 1) The flexible optoelectronic circuit according to claim 1, further comprising at least one electrical contact deposited within the first insulating layer. ### Claim 9 (depends on 8) The flexible an optoelectronic according to claim 8, further comprising a first conductive layer deposited on the first flexible insulating layer and in electrical connectivity with the at least one electrical contact. ### Claim 10 (depends on 9) The flexible optoelectronic circuit according to claim 9, further comprising a second conductive layer deposited on the second flexible insulating layer and in electrical connectivity with the first conductive layer. ### Claim 11 (depends on 1) The flexible optoelectronic circuit according to claim 1, further comprising: at least one optical element deposited on a portion of the second insulating layer; and a third insulating layer deposited on the second insulating layer and the at least one optical element deposited on the second insulating layer. ### Claim 12 A flexible optoelectronic circuit, comprising: a first flexible insulating layer; a second flexible insulating layer deposited on the first insulating layer, the second insulating layer having at least one optical element pattern defined therein; at least one optical element deposited within the at least one optical pattern of the second insulating layer; and a third flexible insulating layer deposited on the second insulating layer and the at least one optical element, wherein the optoelectronic circuit is independent of a substrate. ### Claim 13 (depends on 12) The flexible optoelectronic circuit according to claim 12, wherein the at least one optical element comprises a first material and the first, second, and third insulating layers comprise a second material, the first material having a higher refractive index than the second material. ### Claim 14 (depends on 13) The flexible optoelectronic circuit according to claim 13, wherein the first material comprises a transparent organic material. ### Claim 15 (depends on 14) The flexible optoelectronic circuit according to claim 14, wherein the transparent organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 16 (depends on 13) The flexible optoelectronic circuit according to claim 13, wherein the second material comprises a photoimagable organic material. ### Claim 17 (depends on 16) The flexible optoelectronic circuit according to claim 16, wherein the photoimagable organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 18 (depends on 13) The flexible optoelectronic circuit according to claim 13, wherein the at least one optical element is integrally formed between first and second insulating layers. ### Claim 19 (depends on 12) The flexible optoelectronic circuit according to claim 12, further comprising at least one electrical contact deposited within the first insulating layer. ### Claim 20 (depends on 19) The flexible optoelectronic circuit according to claim 19, further comprising a first conductive layer deposited on the first flexible insulating layer and in electrical connectivity with the at least one electrical contact. ### Claim 21 (depends on 20) The flexible optoelectronic circuit according to claim 20, further comprising a second conductive layer deposited on the second flexible insulating layer and in electrical connectivity with the first conductive layer. ### Claim 22 (depends on 12) The flexible optoelectronic circuit according to claim 12, further comprising: a fourth insulating layer deposited on the third insulating layer, the fourth insulating layer having at least one optical pattern defined therein; at least one optical element deposited within the at least one optical element pattern of the fourth insulating layer; and a fifth insulating layer deposited on the fourth insulating layer and the at least one optical element deposited within the fourth insulating layer. ### Claim 23 An optoelectronic circuit, comprising: a substrate; a release layer deposited on the substrate; a first flexible insulating layer deposited on the release layer; at least one optical element deposited on a portion of the first insulating layer; and a second flexible insulating layer deposited on the first insulating layer and the at least one optical element, wherein the first and second insulating layers comprise a flexible optoelectronic circuit when separated from the substrate and release layer. ### Claim 24 (depends on 23) The optoelectronic circuit according to claim 23, wherein the at least one optical element comprises a first material and the first and second insulating layers comprise a second material, the first material having a higher refractive index than the second material. ### Claim 25 (depends on 24) The optoelectronic circuit according to claim 24, wherein the first material comprises a transparent organic material. ### Claim 26 (depends on 25) The optoelectronic circuit according to claim 25, wherein the transparent organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 27 (depends on 24) The optoelectronic circuit according to claim 24, wherein the second material comprises a photoinagable organic material. ### Claim 28 (depends on 27) The optoelectronic circuit according to claim 27, wherein the photoimagable organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 29 (depends on 24) The optoelectronic circuit according to claim 24, wherein the at least one optical element is integrally formed between first and second insulating layers. ### Claim 30 (depends on 23) The optoelectronic circuit according to claim 23, further comprising at least one electrical contact deposited within the first insulating layer. ### Claim 31 (depends on 30) The optoelectronic circuit according to claim 30, further comprising a first conductive layer deposited on the first flexible insulating layer and in electrical connectivity with the at least one electrical contact. ### Claim 32 (depends on 31) The optoelectronic circuit according to claim 31, further comprising a second conductive layer deposited on the second flexible insulating layer and in electrical connectivity with the first conductive layer. ### Claim 33 (depends on 23) The optoelectronic circuit according to claim 23, wherein the substrate comprises a material at least partially transparent to ultraviolet light. ### Claim 34 (depends on 33) The optoelectronic circuit according to claim 33, wherein the material at least partially transparent to ultraviolet light is selected from the group consisting of glass and quartz. ### Claim 35 (depends on 33) The optoelectronic circuit according to claim 33, wherein the release layer comprises an ultraviolet light sensitive adhesive layer formed on the substrate. ### Claim 36 (depends on 23) The optoelectronic circuit according to claim 23, wherein the substrate comprises a semiconductor material. ### Claim 37 (depends on 36) The optoelectronic circuit according to claim 36, wherein the release layer comprises an oxide layer formed on the semiconductor material. ### Claim 38 A flexible optoelectronic circuit, comprising: a first flexible insulating layer having a first refractive index; at least one electrical contact deposited within the first insulating layer; a first conductive layer deposited on the first insulating layer and in electrical connectivity with the at least one electrical contact; a second flexible insulating layer having a second refractive index deposited on the first insulating layer, the second insulating layer having at least one optical element pattern defined therein; at least one optical element deposited within the at least one optical pattern of the second insulating layer comprising a material having a third refractive; and a third flexible insulating layer having a fourth refractive index deposited on the second insulating layer and the at least one optical element the third refractive index being higher than the first, second, and fourth refractive indices, wherein the optoelectronic circuit is independent of a substrate. ### Claim 39 (depends on 38) The flexible optoelectronic circuit according to claim 38, wherein the at least one optical element comprises a transparent organic material. ### Claim 40 (depends on 39) The flexible optoelectronic circuit according to claim 39, wherein the transparent organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 41 (depends on 38) The flexible optoelectronic circuit according to claim 38, wherein the second insulating layer comprises a photoimagable organic material. ### Claim 42 (depends on 41) The flexible optoelectronic circuit according to claim 41, wherein the photoimagable organic material is selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 43 (depends on 38) The flexible optoelectronic circuit according to claim 38, further comprising a second conductive layer deposited on the second flexible insulating layer and in electrical connectivity with the first conductive layer. ### Claim 44 A method of forming a flexible optoelectronic circuit, comprising: depositing a release layer on a substrate; depositing a first flexible insulating layer on the substrate; depositing a second flexible insulating layer on the first flexible insulating layer; defining at least one optical element pattern in the second flexible layer; depositing at least one optical element within the at least one optical element pattern; depositing a third flexible insulating layer on the second flexible insulating layer and the at least one optical element; and releasing the release layer from the first flexible insulating layer so as to remove the release layer and the substrate from the flexible optoelectronic circuit construct. ### Claim 45 (depends on 44) The method according to claim 44, wherein depositing a release layer comprises depositing an oxide layer on a semiconductor substrate. ### Claim 46 (depends on 45) The method according to claim 45, wherein depositing an oxide layer comprises growing an oxide layer on a semiconductor substrate. ### Claim 47 (depends on 45) The method according to claim 45, wherein releasing the release layer comprises etching the oxide layer. ### Claim 48 (depends on 44) The method according to claim 44, wherein depositing the second insulating layer comprises depositing a photoimagable organic material. ### Claim 49 (depends on 48) The method according to claim 48, wherein the defining at least one optical element pattern comprises imaging and etching an optical element pattern. ### Claim 50 (depends on 48) The method according to claim 48, wherein depositing a photoimagable organic material comprises depositing a photoimagable organic material selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 51 (depends on 44) The method according to claim 44, wherein depositing a release layer comprises depositing an ultraviolet light sensitive adhesive on a material at least partially transparent to ultraviolet light. ### Claim 52 (depends on 51) The method according to claim 51, wherein releasing the release layer comprises exposing the ultraviolet light sensitive adhesive to ultraviolet light. ### Claim 53 (depends on 44) The method according to claim 44, further comprising depositing a conductive layer on at least one insulating layer. ### Claim 54 (depends on 53) The method according to claim 53, further comprising depositing electrical contacts within the first insulating layer, wherein the electrical contacts are in electrical connectivity with the conductive layer. ### Claim 55 (depends on 44) The method according to claim 44, wherein depositing the first, second, and third insulating layers comprises depositing via spin-on deposition. ### Claim 56 A method of forming a flexible optoelectronic circuit, comprising: depositing a release layer on a substrate; depositing a first flexible insulating layer on the substrate; depositing at least one optical element on a portion of the first flexible insulating layer; depositing a second flexible insulating layer on the first flexible insulating layer and the at least one optical element; and releasing the release layer from the first flexible insulating layer so as to remove the release layer and the substrate from the flexible optoelectronic circuit construct. ### Claim 57 (depends on 56) The method according to claim 56, wherein depositing a release layer comprises depositing an oxide layer on a semiconductor substrate. ### Claim 58 (depends on 57) The method according to claim 57, wherein depositing an oxide layer comprises growing an oxide layer on a semiconductor substrate. ### Claim 59 (depends on 57) The method according to claim 57, wherein releasing the release layer comprises etching the oxide layer. ### Claim 60 (depends on 56) The method according to claim 56, wherein depositing a release layer comprises depositing an ultraviolet light sensitive adhesive on a material at least partially transparent to ultraviolet light. ### Claim 61 (depends on 60) The method according to claim 60, wherein releasing the release layer comprises exposing the ultraviolet light sensitive adhesive to ultraviolet light. ### Claim 62 (depends on 56) The method according to claim 56, wherein depositing the first and second insulating layers comprises depositing via spin-on deposition. ### Claim 63 (depends on 56) The method according to claim 56, wherein depositing the at least one optical element comprises depositing a photoimagable organic material, imaging the photoimagable material, and etching an optical element. ### Claim 64 (depends on 63) The method according to claim 63, wherein depositing a photoimagable organic material comprises depositing a photoimagable organic material selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 65 (depends on 56) The method according to claim 56, further comprising depositing a conductive layer on at least one insulating layer. ### Claim 66 (depends on 65) The method according to claim 65, further comprising depositing electrical contacts within the first insulating layer, wherein the electrical contacts are in electrical connectivity with the conductive layer. ### Claim 67 A flexible optoelectronic circuit formed by the process, comprising: depositing a release layer on a substrate; depositing a first flexible insulating layer on the substrate; depositing at least one optical element on the first flexible insulating layer; depositing a second flexible insulating layer on the first flexible insulating layer and the at least one optical element; and releasing the release layer from the first flexible insulating layer so as to remove the release layer and the substrate from the flexible optoelectronic circuit construct. ### Claim 68 (depends on 67) The flexible optoelectronic circuit according to claim 67, wherein depositing a release layer comprises depositing an oxide layer on a semiconductor substrate. ### Claim 69 (depends on 68) The flexible optoelectronic circuit according to claim 68, wherein depositing an oxide layer comprises growing an oxide layer on a semiconductor substrate. ### Claim 70 (depends on 68) The flexible optoelectronic circuit according to claim 68, wherein releasing the release layer comprises etching the oxide layer. ### Claim 71 (depends on 67) The flexible optoelectronic circuit according to claim 67, wherein depositing a release layer comprises depositing an ultraviolet light sensitive adhesive on a material at least partially transparent to ultraviolet light. ### Claim 72 (depends on 71) The flexible optoelectronic circuit according to claim 71, wherein releasing the release layer comprises exposing the ultraviolet light sensitive adhesive to ultraviolet light. ### Claim 73 (depends on 67) The flexible optoelectronic circuit according to claim 67, wherein depositing the first and second insulating layers comprises depositing via spin-on deposition. ### Claim 74 (depends on 67) The flexible optoelectronic circuit according to claim 67, wherein depositing the at least one optical element comprises depositing a photoimagable organic material, imaging the photoimagable material, and etching an optical element. ### Claim 75 (depends on 74) The flexible optoelectronic circuit according to claim 74, wherein depositing a photoimagable organic material comprises depositing a photoimagable organic material selected from the group consisting of polyimides, benzocyclobutene, polyfluorinatedcyclobutene, and aryl ether polymers containing perfluorocyclobutyl linkages. ### Claim 76 (depends on 67) The flexible optoelectronic circuit according to claim 67, the process further comprising depositing a conductive layer on at least one insulating layer. ### Claim 77 (depends on 76) The flexible optoelectronic circuit according to claim 76, the process further comprising depositing electrical contacts within the first insulating layer, wherein the electrical contacts are in electrical connectivity with the conductive layer.