Semiconductor device, image scanning unit and image forming apparatus

Abstract

A semiconductor device is disclosed in which no protruding portion is required and an occurrence of parasitic capacitance is prevented. The semiconductor device includes a substrate 1 which has a wiring portion 5 and a semiconductor chip 2 which has a functional surface 2a in a front surface thereof and which is bonded by flip chip bonding onto said substrate through a holding member. The holding member which holds the semiconductor chip 2 and the substrate 1 is composed of an adhesive material 3 in one embodiment, and the adhesive material adheres the substrate 1 on at least one surface other than both of the front surface and an opposing surface thereof and it is arranged for the adhesive material not to enter a space between the substrate 1 and the semiconductor device 2.

Dependencies are inferred from the claim text.