Wireless radio frequency technique design and method for testing of integrated circuits and wafers
AssigneeThe Governors of the University of Alberta
InventorBrian Moore
Life of this patent
Estimating the term…
Abstract
The present invention is for an apparatus and method for the wireless testing of Integrated Circuits and wafers. The apparatus comprises a test unit external from the wafer and at least one test circuit which is fabricated on the wafer which contains the Integrated Circuit. The test unit transmits an RF signal to power the test circuit. The test circuit, comprising a variable ring oscillator, performs a series of parametric tests at the normal operating frequency of the Integrated Circuit and transmits the test results to the test unit for analysis.
Claims19
A test circuit for testing an integrated circuit on a wafer, the test circuit formed on the wafer with the integrated circuit, the test circuit comprising:
- a) a ring oscillator circuit;
- b) a plurality of sub-circuits coupled to the ring oscillator circuit;
- c) a control circuit to selectively couple the sub-circuits to the ring oscillator circuit;
- d) an antenna adapted to receive a signal;
- e) a power supply circuit coupled to the antenna and adapted to provide power to the test circuit;
- and
- f) a transmitter circuit coupled to the ring oscillator and the antenna and adapted to transmit a test result signal,
- and wherein the test circuit conducts a separate test of the integrated circuit for each sub-circuit selected by the control circuit.
Dependencies are inferred from the claim text.