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AssigneeAdvanced Technology Materials, Inc.
InventorsJose I. Arno, Mark Holst, Sam Yee, Joseph D. Sweeney, Jeff Lorelli, Jason Deseve
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A system for abating undesired component(s) from a gas stream containing same, such as halocompounds, acid gases, silanes, ammonia, etc., by scrubbing of the effluent gas stream with an aqueous scrubbing medium. Halocompounds, such as fluorine, fluorides, perfluorocarbons, and chlorofluorocarbons, may be scrubbed in the presence of a reducing agent, e.g., sodium thiosulfate, ammonium hydroxide, or potassium iodide. In one embodiment, the scrubbing system includes a first acid gas scrubbing unit operated in cocurrent gas/liquid flow, and a second “polishing” unit operated in countercurrent gas/liquid flow, to achieve high removal efficiency with low consumption of water. The scrubbing system may utilize removable insert beds of packing material, packaged in a foraminous containment structure. The abatement system of the invention has particular utility in the treatment of semiconductor manufacturing process effluents.
A scrubbing process for the abatement of a gas component in a gas stream containing same, said scrubbing process comprising introducing the gas stream and a scrubbing liquid to a first gas/liquid contacting chamber and effecting gas/liquid contacting therein, wherein said process additionally comprises flowing the effluent gas from the first contacting chamber to a second gas/liquid contacting chamber and introducing to said second contacting chamber a second scrubbing liquid for gas/liquid contacting therein, wherein the first gas/liquid contacting in the first chamber comprises cocurrent flow of the gas stream and scrubbing liquid and wherein the second gas/liquid contacting in the second contacting chamber comprises countercurrent flow of the gas stream and the second scrubbing liquid through the second contacting chamber, wherein said second contacting chamber has a smaller diameter than that of said first contacting chamber, and wherein the second contacting chamber has a lower water flow rate than the first contacting chamber.
A scrubbing process for treatment of an effluent gas including acid gas components and water-scrubbable components other than acid gas component, said process comprising:
Dependencies are inferred from the claim text.