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US 6,756,663 B2Granted
Semiconductor device including wiring board with three dimensional wiring pattern
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsTsukasa Shiraishi, Tsutomu Mitani, Kazuyoshi Amami, Yoshihiro Bessho
Life of this patent
Estimating the term…
Abstract
A semiconductor device is made by mounting semiconductor elements on both sides of a wiring board having three-dimensional wiring including inner-via holes. A high operating speed and smaller size are made possible by employing a laminated structure of semiconductor elements without using the chip-on-chip configuration. Semiconductor elements are mounted on both sides of a wiring board having three-dimensional wiring including inner via holes so that the semiconductor elements oppose each other via the wiring board. The electrodes of the semiconductor elements are connected with each other by the three-dimensional wiring of the wiring board.
Claims23
A semiconductor device comprising:
- a multi-layer wiring board having a first side and a second side opposite said first side, and including a plurality of insulation layers and a plurality of circuit pattern layers alternately laminated with said insulation layers, one of said circuit pattern layers being formed on a first side and a second side of each of said insulation layers, each of said insulation layers having a plurality of inner via holes extending between said first side and said second side of each of said insulation layers and electrically connecting said circuit pattern layers so as to form a three-dimensional wiring pattern;
- a first semiconductor element including electrodes and being mounted on said first side of said multi-layer wiring board so that a front surface of said first semiconductor element faces said first side of said multi-layer wiring board;
- and
- a second semiconductor element including electrodes and having a front surface and a back surface, said second semiconductor element being mounted on said second side of said multi-layer wiring board so that said front surface of said second semiconductor element faces said second side of said multi-layer wiring board and so that at least a portion of said front surface of said second semiconductor element faces at least a portion of said front surface of said first semiconductor element via said multi-layer wiring board, said electrodes of said second semiconductor element and said electrodes of said first semiconductor element being connected by said three-dimensional wiring pattern, said multi-layer wiring board being bent around said second semiconductor element so as to cover said back surface of said second semiconductor element.
1 more element
A semiconductor device comprising:
- a wiring board having a first side and a second side opposite said first side, and including an insulation layer having a first side and a second side, said wiring board further including a circuit pattern layer formed on each of said first side and said second side, said insulation layer having a plurality of inner via holes extending between said first side and said second side so as to electrically connect said circuit pattern layers such that a three-dimensional wiring pattern is formed;
- a first semiconductor element including electrodes and being mounted on said first side of said wiring board so that a front surface of said first semiconductor element faces said first side of said multi-layer wiring board;
- and
- a second semiconductor element including electrodes and having a front surface and a back surface, said second semiconductor element being mounted on said second side of said wiring board so that said front surface of said second semiconductor element faces said second side of said wiring board and so that at least a portion of said front surface of said second semiconductor element faces at least a portion of said front surface of said first semiconductor element via said wiring board, said electrodes of said second semiconductor element and said electrodes of said first semiconductor element being connected by said three-dimensional wiring pattern, said wiring board being bent around said second semiconductor element so as to cover said back surface of said second semiconductor element.
1 more element
A semiconductor device comprising:
- a wiring board having a first side and a second side opposite said first side, and including an insulation layer having a first side and a second side, said wiring board further including a circuit pattern layer formed on each of said first side and said second side, said insulation layer having a plurality of inner via holes extending between said first side and said second side so as to electrically connect said circuit pattern layers such that a three-dimensional wiring pattern is formed;
- an electronic component including electrodes and being mounted on said first side of said wiring board so that a front surface of said electronic component faces said first side of said wiring board;
- and
- a semiconductor element including electrodes and having a front surface and a back surface, said semiconductor element being mounted on said second side of said wiring board so that said front surface of said semiconductor element faces said second side of said wiring board and so that at least a portion of said front surface of said semiconductor element faces at least a portion of said front surface of said electronic component via said wiring board, said electrodes of said semiconductor element and said electrodes of said electronic component being connected by said three-dimensional wiring pattern, said wiring board being bent around said semiconductor element so as to cover said back surface of said semiconductor element.
1 more element
Dependencies are inferred from the claim text.