Semiconductor device, a semiconductor module loaded with said semiconductor device and a method of manufacturing said semiconductor device

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• wherein said tape is a two-layer tape;
• and
• wherein a ground electric potential plane pattern and a power electric potential plane pattern are formed on a face opposed to a forming face of said common signal wiring and independent signal wiring in said two-layer tape.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• wherein said tape is a two-layer tape;
• and
• wherein an insulating material is interposed between a main face of said chip and signal wiring of said two-layer tape.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• wherein a frame is arranged on one face of said tape so as to surround said chip;
• and
• wherein said frame is constructed by plastic or a metal having a good head radiating property.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• and
• wherein a metallic plate is fixedly attached to said chip.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• and
• wherein said independent signal terminal and another independent signal terminal electrically unconnected to the chip mounted to said tape are arranged on said another side.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry;

• and
• wherein two mirror symmetry tape carrier type semiconductor devices are formed by cutting said tape along a central line on one side on which said independent signal terminal is arranged.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from said tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• and
• wherein pads of said chips are set such that a pad connected to said common signal wiring is arranged far from said independent signal terminal, and a pad connected to independent signal wiring is arranged near said independent signal terminal.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from said tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• and
• wherein plural support leads electrically unconnected to the mounted chip are arranged on another side opposed to the lead of said independent signal terminal.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from said tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• wherein a frame is arranged on one face of said tape so as to surround said chip;
• and
• wherein said frame is constructed by plastic or a metal having a good heat radiating property.

A tape carrier type semiconductor device of a laminating type for mounting plural chips to one tape, wherein a semiconductor device having common signal terminals arranged on one set of two opposed sides, a first independent signal terminal arranged on another side, and a second independent signal terminal electrically unconnected to the chips mounted to said tape is laminated, and the first independent signal terminal at an upper stage and the second independent signal terminal at a lower stage are connected to each other, and the second independent signal terminal at the upper stage and the first independent signal terminal at the lower stage are connected to each other.

A semiconductor module mounting plural tape carrier type semiconductor devices thereto in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals;

• and
• wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier type semiconductor device in which common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.

A semiconductor module mounting plural tape carrier type semiconductor devices thereto in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from a tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals;

• and
• wherein the semiconductor module is constructed by mixing said tape carrier type semiconductor device mounting four chips onto one tape, and a tape carrier type semiconductor device in which common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and the common signal terminals arranged on said one set of two opposed sides are arranged with left-right mirror symmetry, and two chips are mounted onto one tape.

A semiconductor module constructed by laminating a semiconductor device in which plural external terminals are formed on one long side of a rectangular substrate, and common signal terminals are arranged on one set of two opposed sides, and a first independent signal terminal is arranged on another side, and a second independent signal terminal electrically unconnected to a chip mounted to a tape is arranged;

• and mounting plural tape carrier type semiconductor devices in which the first independent signal terminal at an upper stage and the second independent signal terminal at a lower stage are connected to each other, and the second independent signal terminal at the upper stage and the first independent signal terminal at the lower stage are connected to each other, and plural chips are mounted to one tape, wherein said independent signal terminal is arranged along an arranging direction of said external terminals.

A tape carrier type semiconductor device for mounting plural chips to one tape, wherein common signal terminals are arranged on one set of two opposed sides, and an independent signal terminal is arranged on another side, and a lead continuously extends to said common signal terminals and said independent signal terminal and is projected from said tape, and said common signal terminals on the two sides are electrically connected to each other by common signal wiring;

• and
• wherein a metallic plate is fixedly attached to said chip.