Back to results
US 6,756,560 B2Granted
Plasma enhanced circuit component attach method and device
AssigneeGeoMat Insights, LLC
InventorRonald J. Barnett
Life of this patent
Estimating the term…
Abstract
A method and apparatus for bonding a circuit component to a circuit package or board is presented. A pressurized directional flow of plasma is applied between attachment sites of the component to be bonded and the corresponding bond pad of the package/board. During the application of plasma between the bonding surfaces, direct contact fusion/diffusion bonds the component attachment sites to the corresponding bond pads.
Claims8
A plasma enhanced component attachment bonder, comprising:
- a component contacting device which positions a component attachment site of a component into contact with a bond site;
- and
- a plasma generator which applies a pressurized directional flow of plasma at and between said component attachment site of said component and said bond site prior to and during said contact of said component attachment site of said component with said bond site.
Dependencies are inferred from the claim text.