Electron beam processing
AssigneeFEI Company
InventorsChristian R. Musil, J. David Casey, Jr., Thomas J. Gannon, Clive Chandler, Xiadong Da
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AssigneeFEI Company
InventorsChristian R. Musil, J. David Casey, Jr., Thomas J. Gannon, Clive Chandler, Xiadong Da
Estimating the term…
A method and apparatus for electron beam processing using an electron beam activated gas to etch or deposit material. The invention is particularly suitable for repairing defects in lithography masks. By using an electron beam in place of an ion beam, the many problems associated with ion beam mask repair, such as staining and riverbedding, are eliminated. Endpoint detection is not critical because the electron beam and gas will not etch the substrate. In one embodiment, xenon difluoride gas is activated by the electron beam to etch a tungsten, tantalum nitride, or molybdenum silicide film on a transmission or reflection mask. To prevent spontaneous etching by the etchant gas in processed sites at which the passivation layer was removed, processed sites can be re-passivated before processing additional sites.
A method of removing an excess material defect on a photolithography mask, the method comprising:
A method of beam processing multiple sites on a work piece in a vacuum chamber, comprising:
A method of etching a metallic material, the method comprising:
A method of etching a compound of including tantalum and nitrogen, the method comprising:
A method of repairing a defect on a photolithography mask, comprising:
A method of modifying an integrated circuit, comprising:
A system for repairing mask defects, comprising:
Dependencies are inferred from the claim text.