Methods and apparatus for high speed object handling

Abstract

Methods and apparatus for high speed workpiece handling are provided. The method for workpiece handling includes removing a workpiece from a first cassette with a first robot, transferring the workpiece from the first robot directly to a second robot without transferring the workpiece to a transfer station, placing the workpiece on a workpiece holder at a processing station with the second robot, and transferring the workpiece from the workpiece holder to the first cassette with the first robot following processing. End effectors of the first and second robots may each have a plurality of vertical positions for efficient workpiece handling. Displacement error and rotational error of the workpiece may be sensed and corrected without use of a transfer station. The methods and apparatus may be used for handling semiconductor wafers.

Dependencies are inferred from the claim text.