Memory module having buffer for isolating stacked memory devices
AssigneeIntel Corporation
InventorsJohn B. Halbert, Randy M. Bonella
Life of this patent
Estimating the term…
Abstract
The present invention utilizes a buffer to isolate a stack of memory devices, thereby taking advantage of the increased memory density available from stacked memory devices while reducing capacitive loading. A memory module in accordance with the present invention may include a stack of memory devices and a buffer coupled to the first and second memory devices and arranged to capacitively isolate the first and second memory devices from a bus. In a memory system in accordance with the present invention, multiple buffered stacks of memory devices are preferably coupled in a point-to-point arrangement, thereby further reducing capacitive loading.
Claims5
A memory system comprising:
- a first memory device;
- a second memory device stacked on the first memory device;
- and
- a data buffer coupled to the first and second memory devices, wherein the data buffer is not stacked with the first and second memory devices, and the data buffer and memory devices are mounted in separate packages.
A memory system comprising:
- a data bus;
- a stack of memory devices, and
- a data buffer coupled between the stack of memory devices and the data bus, wherein the stack of memory devices is not stacked on the data buffer, and the data buffer and memory devices are mounted in separate packages.
Dependencies are inferred from the claim text.