Surface mount power supplies for standard assembly process
AssigneeInnoveta Technologies
InventorsCarl Milton Wildrick, Gordon K. Y. Lee
Life of this patent
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Abstract
This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.
Claims16
A power module comprising:
- (a) a board having at least one element mounted thereon;
- and
- (b) at least one interconnect for electrically coupling the element to an end user's circuit card, wherein the interconnect is U-shaped, the interconnect further comprising a contact surface having a through hole, said through hole adapted to allow solder paste to flow into the interconnect to form a strong physical bond between the element and the end user's circuit card.
An interconnect for use between a power module and an end user circuit card comprising:
- (a) a first sidewall;
- (b) a contact surface adapted to contact said end user circuit card, said contact surface having at least one through hole, said through hole adapted to flow of solder paste into the interconnect;
- and
- (c) a second side wall, wherein the interconnect is generally U-shaped and conductive.
A method of coupling a power module to an end-user circuit board comprising the steps of:
- (a) applying a solder paste to at least one mounting pad on said circuit board;
- (b) placing a power module having at least one U-shaped interconnect onto the circuit board so that the interconnect contact to solder paste;
- wherein the solder paste flows through holes in the interconnect;
- and wherein a tolerance between the interconnect is absorbed in the solder paste;
- and
- (c) heating the solder paste.
Dependencies are inferred from the claim text.