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US 6,747,873 B1Granted
Channeled heat dissipation device and a method of fabrication
AssigneeIntel Corporation
InventorsDamion Searls, Tom Pearson, James Jackson
Life of this patent
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Abstract
Numerous embodiments of a channeled heat dissipation device and a method of fabrication are disclosed. In one embodiment, a channeled heat dissipation device comprising a base portion having a dissipation surface and a substantially opposed mounting surface, and at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface.
Claims8
A microelectronic assembly, comprising:
- a microelectronic die having a back surface and an active surface;
- a heat dissipation device coupled to the microelectronic die back surface, wherein said heat dissipation device comprises:
- a base portion having a dissipation surface and a substantially opposed mounting surface;
- at least one channel defined in the base portion, wherein said at least one channel extends from said dissipation surface to said mounting surface;
- a plurality of projections extending from said base portion dissipation surface;
- a fan mounted on at least a portion of said plurality of projections to provide airflow substantially towards said at least one channel;
- and
- a shroud formed between said fan and said base portion, and formed proximate to said plurality of projections;
- and
- a substrate having a primary and a secondary side, wherein said substrate secondary side is coupled to said microelectronic die active surface;
- and
- another fan coupled to the secondary side of said substrate, said other fan positioned to provide airflow to at least a portion of said secondary side.
9 more elements
Dependencies are inferred from the claim text.