Microcomputer heat dissipation system
OwnerGuangji Donginventor
Life of this patent
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Abstract
A microcomputer heat dissipation system comprising heat-absorbing units, wherein said heat-absorbing units can be bonded to heat-generating electrical components inside the microcomputer and are in communication with a fluid circulating unit, and, to said fluid-circulating unit, there can be serially connected at least a heat-radiating pipe bondable to a heat-radiating plate, with said heat-radiating plate disposed on the outer wall surface of the chassis. In this manner, most of the heat generated by the microcomputer is dissipated to the space outside of the microcomputer, and, at the same time, the elimination of the internal fans of the microcomputer permits a considerable reduction in the acoustic noise level during operation of the microcomputer.
Claims33
A microcomputer heat dissipation system comprising heat-absorbing units, said heat-absorbing units being bonded to heat-generating electrical components inside the microcomputer and disposed in communication with a fluid circulating unit, and, to said fluid circulating unit, there is serially connected at least a heat-radiating pipe bonded to a heat-radiating plate, with said heat-radiating plate disposed on an outer wall surface of a chassis.
A microcomputer heat dissipation system comprising a power supply heat dissipation system and a circulation-based heat dissipation system inside a microcomputer chassis, which is characterized by the fact that in a power supply heat-absorbing unit, high-power transistors of a power supply unit are connected to a heat-radiating plate via a heat-conducting device by means of planar contact, and that the above-mentioned circulation-based heat dissipation system is made up of heat-absorbing units bondable to heat-generating electrical components and said heat-absorbing units are in communication with a fluid circulating unit, and, to said fluid circulating unit, there can be serially connected at least a heat-radiating pipe bonded to the heat-radiating plate, with said heat-radiating plate disposed on an outer wall surface of the chassis.
Dependencies are inferred from the claim text.