System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector
AssigneeAlcatel
InventorSteven Skeoch
Life of this patent
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Abstract
A system and method for providing high voltage resistance capability in a receptacle apparatus for accepting a high-density compliant pin connector. A plurality of high-density compliant pin through-holes are formed in a printed circuit board for receiving the pins of the high-density compliant pin connector. The through-holes are plated using an electrically conductive material, whereby conductive pads are formed around the plated through-holes on at least one side of the printed circuit board. Thereafter, the conductive pads around the plated through-holes on the printed circuit board are removed by controlled depth back-drilling so as to increase the inter-pad clearance of the through-holes for withstanding foreign voltages.
Claims21
A method of reducing susceptibility to inter-pin arcing in a high-density compliant pin connector, comprising the steps of:
- fabricating high-density compliant pin through-holes in a printed circuit board for receiving said high-density compliant pin connector;
- plating said through-holes using an electrically conductive material, said electrically conductive material forming conductive pads around said plated through-holes on at least one side of said printed circuit board;
- and
- backdrilling at least a portion of said conductive pads around said plated through-holes on said at least one side of said printed circuit board so as to increase inter-pad clearance of said through-holes.
A high-voltage resistant receptacle apparatus for accepting a high-density compliant pin connector, comprising:
- a printed circuit board having a plurality of through-holes corresponding to the number of pins disposed in said high-density compliant pin connector;
- at least one layer of conductive plated material deposited in said through-holes;
- and
- a back-drilled portion formed on said printed circuit board, wherein said back-drilled portion effectuates removal of conductive pad material formed around said through-holes on at least one side of said printed circuit board so as to increase inter-pad clearance between said through-holes.
A method of increasing resistance to foreign voltages in high-density compliant pin connectors, comprising:
- forming a plurality of high-density compliant pin through-holes in a printed circuit board corresponding to the number of pins disposed in a high-density compliant pin connector;
- plating said through-holes using a metallic plating material, said plating material forming metallic pads exposed on both sides of said printed circuit board around each of said plated through-holes;
- and
- back-drilling said printed circuit board on both sides to remove said metallic pads formed around said through-holes so as to increase inter-pad clearance between said through-holes.
Dependencies are inferred from the claim text.