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US 6,747,820 B2Granted
Cooling opto-electronic packages
AssigneeIntel Corporation
InventorsEric J. Zbinden, Tom Mader, Jan Peeters Weem
Life of this patent
Estimating the term…
Abstract
An opto-electronic module may be provided with an internal thermoelectric cooler. Components to be cooled may be positioned over the thermoelectric cooler. Other components may be positioned aside the cooled components but raised, using a riser, to position them away from the cooled components.
Claims24
A method comprising:
- providing a package for an opto-electronic module;
- including a thermoelectric cooler in said package;
- and
- mounting elements to be cooled over said thermoelectric cooler and mounting elements not to be cooled on a riser adjacent said thermoelectric cooler.
1 more element
A package for an opto-electronic module comprising:
- a can body;
- a thermoelectic cooler in said can body;
- and
- a riser positioned adjacent said thermoelectic cooler to define an uncooled surface on top of said riser.
1 more element
A thermoelectric cooler module comprising:
- a thermoelectric cooler;
- a cooled surface positioned over said thermoelectric cooler;
- a riser adjacent said cooler;
- and
- an uncooled surface positioned on the riser adjacent said thermoelectric cooler.
2 more elements
Dependencies are inferred from the claim text.